Formation of Porous Silicon by Nanopowder Sintering
- Авторлар: Astrova E.V.1, Voronkov V.B.1, Nashchekin A.V.1, Parfeneva A.V.1, Lozhkina D.A.1, Tomkovich M.V.1, Kukushkina Y.A.1
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Мекемелер:
- Ioffe Institute
- Шығарылым: Том 53, № 4 (2019)
- Беттер: 530-539
- Бөлім: Physics of Semiconductor Devices
- URL: https://journals.rcsi.science/1063-7826/article/view/205991
- DOI: https://doi.org/10.1134/S1063782619040031
- ID: 205991
Дәйексөз келтіру
Аннотация
The technique of the electrochemical and photoelectrochemical etching of single-crystal silicon wafers commonly used to fabricate macroporous silicon layers is inefficient and costly. An alternative method for forming bulk macroporous silicon is the high-temperature sintering of Si powder. The process of nanopowder sintering preliminarily subjected to dry cold compression (without binding additives) is investigated. The properties of the sintered material, including its microstructure, density, and electrical conductivity, are studied at different annealing temperature and time. Techniques for changing the porosity of the sintered samples and for determining of the interior surface area are discussed.
Авторлар туралы
E. Astrova
Ioffe Institute
Хат алмасуға жауапты Автор.
Email: east@mail.ioffe.ru
Ресей, St. Petersburg, 194021
V. Voronkov
Ioffe Institute
Email: east@mail.ioffe.ru
Ресей, St. Petersburg, 194021
A. Nashchekin
Ioffe Institute
Email: east@mail.ioffe.ru
Ресей, St. Petersburg, 194021
A. Parfeneva
Ioffe Institute
Email: east@mail.ioffe.ru
Ресей, St. Petersburg, 194021
D. Lozhkina
Ioffe Institute
Email: east@mail.ioffe.ru
Ресей, St. Petersburg, 194021
M. Tomkovich
Ioffe Institute
Email: east@mail.ioffe.ru
Ресей, St. Petersburg, 194021
Yu. Kukushkina
Ioffe Institute
Email: east@mail.ioffe.ru
Ресей, St. Petersburg, 194021
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