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Vol 52, No 15 (2018)

Basic Research

Field Characteristics of Spin-Torque Diode Sensitivity in the Presence of a Bias Current

Popkov A.F., Kulagin N.E., Demin G.D., Zvezdin K.A.

Abstract

The use of the spin-torque diode effect, which is generated upon the current-induced transfer of spin angular momentum in magnetic tunnel junctions, opens the prospect of considerably improving microwave sensitivity in the gigahertz frequency band over that of semiconductor Schottky diodes. In this work, the spin-diode effect of microwave signal rectification in a magnetic tunnel junction upon the resonant excitation of spin waves in the free magnetic layer as a result of the current-induced spin-transfer torque effect is analyzed theoretically. Frequency characteristics of the resonant response of a spin-torque diode to a microwave signal are calculated in the linear macrospin approximation as functions of the direction and value of the applied magnetic field and bias current. It is shown that with zero bias current, the maximum rectified voltage across a junction is obtained in the geometry of mutually perpendicular magnetizations of magnetic layers; as the resonant frequency of oscillations in a magnetic field increases, this voltage drops at the retained equilibrium orientation of spins in the layers. After the bias current is switched on, the resonance amplitude of forced oscillations of the free layer spins upon microwave excitation grows sharply at the critical point of the spin-torque diode’s loss of equilibrium state stability. The linewidth at this point is limited only by nonlinear effects. Improving spin-torque diode sensitivity is important for its use in microwave holographic vision systems.

Semiconductors. 2018;52(15):1909-1914
pages 1909-1914 views

Electron Transport by a Transverse Acoustoelectric Stoneley Wave

Morocha A.K., Rozhkov A.S.

Abstract

The effect of acoustoelectric charge transport is associated with the possibility of amplifying acoustoelectric waves using an external electric field and has been studied in detail for body and surface waves. Electron transport by a transverse acoustoelectric wave (e.g., a Stoneley wave propagating along the heterojunction of two piezoelectric semiconductor layers) is considered in this work for the first time. Analytical expressions for the acoustic conductivity tensor components are derived that depend on the wave phase velocity and electron drift velocity in an external electric field. It is shown that the alternating acoustoelectric current is a sum of two surface currents: the drift current, which depends linearly on the external electric field, and the current that depends nonlinearly on this field. An expression for the acoustoelectric electron mobility is derived. It is found that the acoustoelectric current induced by an electron density wave grows infinitely when the electron drift velocity becomes equal to the wave phase velocity. The analytical expressions obtained for the mobility and current density can be used in calculating current–voltage characteristics of Stoneley wave acoustoelectric field-effect transistors.

Semiconductors. 2018;52(15):1915-1918
pages 1915-1918 views

Predicting the Optical Properties of Matrix Composites Containing Spherical Inclusions with Metal Shells

Lavrov I.V.

Abstract

Individual small particles consisting of an insulating core and a metal shell exhibit more intricate behavior when exposed to electromagnetic radiation than continuous metal particles. A composite medium containing a large number of such particles is therefore bound to have new optical properties. If the inclusions are small relative to the wavelength of electromagnetic radiation, the optical characteristics of an inhomogeneous medium can be estimated from its effective permittivity. On the basis of the generalized effective field approximation, a formula is derived to calculate the effective dielectric characteristics of a matrix composite containing spherical inclusions with shells. The formula can be considered a generalization of the classical Maxwell–Garnett formula for a matrix medium with inhomogeneous inclusions consisting of anisotropic cores and isotropic shells. Using the formula, the frequency dependences of the real and imaginary parts of the effective permittivity in the 0.282–0.855 μm range of wavelengths are calculated for a composite consisting of an α-quartz matrix and spherical nanoinclusions with α-quartz cores and silver shells. The dependences are obtained for different relative volume fractions of cores in the inclusions and of inclusions in the composite. The frequency dependences of the refractive index, the extinction coefficient of the composite, and the transmittance and reflectance of a thin composite film are calculated for the range of wavelengths indicated above. It is shown that inclusions with metal shells in a matrix composite result in an additional plasmon resonance, compared to a composite containing all-metal inclusions. With a matrix composite, the additional plasmon resonance is observed at a wavelength of 0.33–0.34 μm in the ultraviolet range and is much less intense than the principal plasmon resonance. The additional plasmon resonance is responsible for the very low transmittance of a composite film in the ultraviolet region. At a constant volume fraction of inclusions in the composite, an increase in the volume fraction of the cores in them shifts the principal plasmon resonance to longer wavelengths and lowers its intensity.

Semiconductors. 2018;52(15):1919-1924
pages 1919-1924 views

Quantum Efficiency of Gallium Nitride–Based Heterostructures with GaInN Quantum Wells

Vigdorovich E.N.

Abstract

An important parameter of light-emitting heterostructures is their external quantum efficiency. However, another strict requirement for the structures used in fabricating blue and white light-emitting diodes is that the wavelength in the emission spectrum peak and its spread over the entire structure must be 460 ± 5 nm. This is explained primarily by the most frequently used white light-emitting diode design being based on crystals coated with a luminescent layer of a certain composition excited by blue emissions. Deviating from the specified spectral parameters of heterostructures strongly degrades the light and color characteristics of light-emitting diodes. In this work, we solve the problem of optimizing the design and way of growing the active region of an emitting structure consisting of a set of Ga1 – xInxN quantum wells and wider-gap GaN barriers with a certain wavelength in the emission spectrum peak. The variation in the critical thickness of the pseudomorphic layer in the Poisson ratio ranges of 0 to 0.2 for GaAlN and 0 to 0.4 for GaInN is calculated. The emission wavelength is determined by both the bulk Ga1 – xInxN band gap, which depends on the molar fraction of In in quantum wells, and the quantum well thickness in quantum-sized layers. It is found from the obtained dependences that to obtain the required wavelength of 460 nm in the emission spectrum peak, the Ga1 – xInxN layers must be around 10.3% indium and have a quantum well thickness of about 2.5 nm. The effect the In distribution profile in quantum wells has on the external quantum efficiency, the uniformity of the emission wavelength distribution in the spectral peak, and the emission power distribution over the structure is considered. The best results are obtained for a trapezoidal In distribution, since it ensures the narrowest emission wavelength spread in the spectral peak and the most uniform emission power distribution over the structure. Studying the effect the number of quantum wells has on the properties of a heterostructure shows that the maximum external quantum efficiency corresponds to 4 to 5 quantum wells. The highest emission wavelength uniformity in the spectral peak over the structure is obtained at 5 to 7 quantum wells. The optimum number of quantum wells in the active region of the heterostructure is found to be 5.

Semiconductors. 2018;52(15):1925-1930
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Measuring the Effective Masses of the Electrical Conductivity and Density of States by Contactless Microwave Means

Usanov D.A., Postelga A.E., Gurov K.A.

Abstract

Knowledge of the effective mass of quasiparticles is needed for studying the band structure of semiconductors, simulating processes of conductivity, and developing actual semiconductor devices. The problem of determining the effective mass of carriers in a particular sample is therefore of great interest. Using the example of silicon, it is shown in this work that it is possible to determine the effective masses of conductivity and the density of states by treating a measured microwave reflection spectrum as a set of information parameters. The inverse problem is solved of finding the conditions for the minimum of the difference of squares of values corresponding to known theoretical and experimentally measured spectral dependences. Calculations and experiments are performed for the temperature range of 130–190 K, in which the highest accuracy of measurements is ensured. For Ga-doped p-silicon and Sb-doped n-silicon, values of the desired effective masses are obtained that coincide with ones given in the literature. The proposed contactless technique allows simultaneous determination of the effective masses of conductivity and density of states of charge carriers using conventional equipment. The approach can be used to measure the parameters of other types of semiconductors, including ones that are little studied.

Semiconductors. 2018;52(15):1931-1935
pages 1931-1935 views

Electronics Materials

Effect of the Plasma Functionalization of Carbon Nanotubes on the Formation of a Carbon Nanotube–Nickel Oxide Composite Electrode Material

Alekseyev A.V., Lebedev E.A., Gavrilin I.M., Kitsuk E.P., Ryazanov R.M., Dudin A.A., Polokhin A.A., Gromov D.G.

Abstract

The unique properties of carbon nanotubes (CNTs) make these systems promising for the production of composite electrode materials based on a combination of CNTs and transition metal oxides. The effect the parameters of the functionalization of vertically aligned CNT arrays in mixed argon–oxygen high-frequency plasma have on the structural characteristics of CNTs is studied by Raman spectroscopy. The effect the duration of treatment at higher partial argon consumption and low total gas consumption of the working mixture has on the distribution of nickel oxide over a CNT array deposited via SILAR is determined. Results from scanning electron microscopy show that lengthening the duration of functionalization from 30 to 1200 s allows the depth of coating a CNT surface with a nickel oxide layer to be increased from 300 nm to 2.5 μm. Composite structures produced in this work can be used as electrodes of supercapacitors.

Semiconductors. 2018;52(15):1936-1941
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Determining the Concentration of Free Electrons in n-InSb from Far-Infrared Reflectance Spectra with Allowance for Plasmon–Phonon Coupling

Belova I.M., Belov A.G., Kanevsky V.E., Lysenko A.P.

Abstract

Contactless nondestructive testing is a means for determining the concentration of free electrons N in indium antimonide (InSb) samples from far-infrared reflectance spectra recorded at room temperature. A computer program capable of determining the characteristic wave number from the Kramers–Kronig relation is developed. The calculated calibration dependence makes it possible to determine the electron concentration from the known characteristic wave number. It is shown that this dependence is described by a cubic polynomial. In the calculations, the energy dependence of the electron effective mass is taken into account. It is established that, in determining the electron concentration, account must be taken of plasmon–phonon coupling, specifically at N ≤ 5 × 1017 cm–3. The systematic error introduced into the determination of N by disregard of plasmon–phonon coupling is estimated. The software elaborated here makes it possible to calculate the electron concentration N from experimental reflectance spectra and to store and process the results. The software is tested by the example of the reflectance spectrum of heavily doped n-InSb.

Semiconductors. 2018;52(15):1942-1946
pages 1942-1946 views

Studying the Effect of Electrically Active Impurities Coming from Trimethylgallium Synthesized by Different Means on the Electrophysical Characteristics of Gallium Arsenide Epitaxial Layers

Revin M.V., Kotkov A.P., Ivanov V.A., Rad’kov Y.F., Svinkov N.V., Artemov A.N., Gribov B.G.

Abstract

Chemical deposition from vapors of metalorganic compounds and volatile hydrides (metalorganic vapor phase epitaxy) is the main way of growing devices’ heteroepitaxial structures based on gallium arsenide (GaAs) and solid solutions of it (AlxGa1 – xAs and InyGa1 – yAs) on an industrial scale. Electrically active impurities deposited uncontrollably on epitaxial layers during growth worsen the electrophysical parameters of devices’ structures. Sources of deposited background impurities include the initial material. In this work, ways of synthesizing trimethylgallium (TMG) are compared from the viewpoint of impurities, especially electrically active GaAs, being incorporated into the final product. Ways of preparing TMG that include the exchange reaction between gallium trichloride and trimethylaluminum (TMA) and magnesium–organic syntheses in which metallic magnesium is used as the initial reagent are selected as the objects of study. The behavior of electrically active impurities during the purification of TMG via rectification is studied. The investigations are performed by means of spectral analysis and functional control over the growth of electrophysical parameters of GaAs epitaxial layers from TMG and arsine. It is established that the qualitative and quantitative composition of impurities in TMG depends on their content in the initial reagents. TMG prepared using the exchange reaction between gallium trichloride and TMA is the source of n-type impurities in GaAs. These are mainly Group IV elements (silicon, tin, and lead), with silicon impurities predominating. TMG fabricated using metallic magnesium is a source of both p- (preferentially zinc) and n-type (preferentially silicon) impurities. Irrespective of the quality of the initial raw TMG, the use of reduced-pressure rectification allows the fabrication of TMG with low impurity contents. Epitaxial GaAs layers grown using purified TMG (TMG rectificate) have n-type conduction with a low level of background doping (0.7–4) × 1014 cm–3 and high carrier mobilities of 7300–8500 cm2/(V s) at 300 K and 90 000–156 000 cm2/(V s) at 77 K. These values correspond to purest samples made with TMG and arsine using MOC-hydride epitaxy. Based on the data on functional control, the content of impurities that display electrical activity in GaAs is on the level of 10−7–10−6 at % in fabricated TMG-rectificate samples.

Semiconductors. 2018;52(15):1947-1952
pages 1947-1952 views

Technological Processes and Routes

Dependence of Mechanical Stresses in Silicon Nitride Films on the Mode of Plasma-Enhanced Chemical Vapor Deposition

Novak A.V., Novak V.R., Dedkova A.A., Gusev E.E.

Abstract

Films of silicon nitride SiNx, obtained by plasma-enhanced chemical vapor deposition from the monosilane SiH4 and ammonia NH3 gases, are widely used in microelectronics and micro- and nanoelectromechanical systems. Residual mechanical stresses and film composition are important characteristics for many applications. The properties of SiNx films, particularly mechanical stresses and composition, depend largely on the conditions of production, e.g., the ratio of the reacting gas flow rates, the composition of the gas mixture, the power and frequency of the plasma generator, and the temperature and pressure during deposition. Despite the great volume of works on the subject, data regarding the dependence of the properties and composition of SiNx films on the conditions of production remain sparse. This work considers the effect the ratio of the reacting gas flow rates has on the mechanical stresses and composition of silicon nitride films SiNx obtained by plasma-enhanced chemical vapor deposition from gaseous mixtures of SiH4 monosilane and NH3 ammonia using low-frequency plasma. It is found that when the ratio of the gas flow rates of SiH4 and NH3 is raised from 0.016 to 0.25, the compressive mechanical stresses are reduced by 31%, the stoichiometric coefficient falls from 1.40 to 1.20, the refractive index rises from 1.91 to 2.08, the concentration of N–H bonds is reduced by a factor of 7.4, the concentration of Si–H bonds grows by a factor of 8.7, and the concentration of hydrogen atoms is reduced by a factor of 1.5. These results can be used for the controlled production of SiNx films with such specified characteristics as residual mechanical stresses, refractive index, stoichiometric coefficient, and the concentration of hydrogen-containing bonds.

Semiconductors. 2018;52(15):1953-1957
pages 1953-1957 views

Using Combined Optical Techniques to Control the Shallow Etching Process

Volokhovskiy A.D., Gerasimenko N.N., Petrakov D.S.

Abstract

Controlling the procedure for etching shallow trench insulation (STI) is part of the CMOS production cycle. Optical scatterometry, which allows the simultaneous replacement of several techniques used earlier, can be used to increase the reliability of and information obtained with this control process. The etching of shallow trench insulation is described in this work using a dimensional scheme that considers features of the actual procedure. Combined means of controlling the etching of shallow trench insulation are presented. The boundaries of optical scatterometry applicability are investigated, and means are considered that can be used beyond these boundaries (particularly in the range below ~20 nm). The proposed procedure allows not only linear dimensions to be controlled, but also the depth of the etching trench and the slope of its walls (which were not controlled earlier) during the production cycle itself. Control of these parameters during the production cycle lowers production costs and improves the reliability of the integrated circuits. The process is substantiated using the example of 180 nm technology, but the possibility of applying the process to smaller design norms is discussed.

Semiconductors. 2018;52(15):1958-1962
pages 1958-1962 views

Characteristics of Amorphous As2S3 Semiconductor Films Obtained via Spin Coating

Hang Thi Nguyen ., Yakubov A.O., Lazarenko P.I., Volkova A.V., Sherchenkov A.A., Kozyukhin S.A.

Abstract

Centrifugation is used in fabricating, e.g., films with large areas and/or thicknesses of several micrometers. However, it has yet to be widely employed for chalcogenide compounds, due to their relatively weak solubility in most solvents. Determining the optimum conditions for preparing solutions of chalcogenide compounds and obtaining films via centrifugation is therefore of great interest. Specific features of amorphous arsenic sulfide (As2S3) films prepared via the centrifugation of solutions in n-butylamine have been studied. These films were characterized by means of X-ray diffraction analysis, IR spectroscopy, atomic-force microscopy and Raman spectroscopy. It was shown that amorphous As2S3 films have a greater elasticity modulus than those of analogous composition produced via thermal evaporation in vacuum, or As2S3 glass. A structural model based on arsenic sulfide clusters whose surfaces are bound by negatively and positively charged ions is used to explain the experimental results obtained in this work. DC measurements show that the amorphous films exhibit semiconductor-type conductivity. Their room temperature conductivity is ~10−15 S/cm, which indicates good dielectric properties. The films are optically transparent starting from the yellow spectral range, making them promising functional materials for engineering applications in optics and photonics.

Semiconductors. 2018;52(15):1963-1968
pages 1963-1968 views

Investigating the RTA Treatment of Ohmic Contacts to n-Layers of Heterobipolar Nanoheterostructures

Egorkin V.I., Zemlyakov V.E., Nezhentsev A.V., Garmash V.I.

Abstract

The preparation of ohmic contacts to heterobipolar nanostructures has a number of characteristic features. In addition to the basic requirement of minimizing contact resistance, contacts to this type of structures have a transition layer whose depth of penetration must not exceed the emitter layer’s thickness, due to the possibility of short-circuiting the emitter base pn junction. In this work, the effect the main technological parameters of rapid thermal annealing have on a contact’s characteristics are examined, and the process of obtaining a low-resistance ohmic contact to heterobipolar transistor layers is optimized. Ohmic contacts to the n-layers of heterobipolar nanoheterostructures based on gallium arsenide and produced via layer-by-layer electron-beam deposition of Ge/Au/Ni/Au are considered. The diffusion distribution profiles of doping with Ge impurities are calculated as a function of the time and temperature of rapid thermal annealing, and are examined via scanning electron microscopy. It is found that rapid thermal annealing for 60 s at a temperature of 398°C yields ohmic contacts with low resistance, smooth surface morphology, and the minimum size of the transition layer.

Semiconductors. 2018;52(15):1969-1972
pages 1969-1972 views

Elements of Integral Electronics

A Physical Model of an SOI Field-Effect Hall Sensor

Korolev M.A., Pavlyuk M.I., Devlikanova S.S.

Abstract

Studies in the field of the development of new structures of Hall sensor with improved characteristics, in particular with increased magnetic sensitivity are in high demand. A physical model is proposed, which explains features of the Hall–hate characteristic and the formation of the increased magnetic sensitivity region in the SOI field-effect Hall sensor (SOI FEHS). The results of simulation in the Synopsys TCAD system confirm the proposed physical model of SOI FEHS functioning. The model explains features of the Hall–gate characteristic of the SOI FEHS in a wide range of gate voltages and allows the conclusion that the SOI FEHS has two operating regions and their choice is dictated by specific conditions of the sensor application. To achieve the maximum magnetic sensitivity, regions of partial depletion and enhancement should be chosen. To provide high noise immunity, it is reasonable to choose the full enhancement modes.

Semiconductors. 2018;52(15):1973-1975
pages 1973-1975 views

Patterns of Variation in the External Quantum Efficiency of InGaN/GaN Green LEDs during Accelerated Tests

Sergeev V.A., Frolov I.V., Shirokov A.A., Radaev O.A.

Abstract

The causes and mechanisms of variation in the quantum efficiency and other characteristics of InGaN/GaN heterostructures are actively investigated in various operating modes. The results are presented from an experimental study of the variation in the external quantum efficiency of low-power InGaN/GaN green light-emitting diodes with and without a quantum well in the space–charge region (SCR) of the heterostructure in the accelerated test mode. It is found that after 8 hours of testing at a temperature of 300 K in the pulse mode with a pulse amplitude of 0.5 A, a pulse duration of 100 µs, and a duty cycle of 100, the external quantum efficiency grows for all LEDs without a quantum well in the SCR and diminishes for LEDs with a quantum well throughout the range of operating currents. It is shown that at a low level of injection, the intensity of emission of light emitting diodes without a quantum well in the SCR is determined by recombination processes according to the Shockley–Read–Hall mechanism, while that of LEDs with a quantum well is determined by tunneling–recombination processes. Current training of green LEDs based on InGaN/GaN heterostructures in the forced pulse mode for 4 hours can be used as a technological operation for stabilizing their lighting characteristics, and for identifying potentially unreliable products under conditions of mass production.

Semiconductors. 2018;52(15):1976-1981
pages 1976-1981 views

Analysis of the Switching Characteristics of MRAM Cells Based on Materials with Uniaxial Anisotropy

Iusipova I.A.

Abstract

Magnetoresistive random access memory (MRAM) has some advantages over other types of memory. However, MRAM has one substantial drawback: the current density and magnetic field that must be applied to switch the spin-valve free layer inside an MRAM cell are too high. The dependence of the current density and switching magnetic field on the magnetic parameters of the material from which the ferromagnetic layers of a spin valve are fabricated is therefore analyzed. A comparison of the critical characteristics of a spin valve with longitudinal anisotropy shows that cobalt, iron, and alloys of them; cobalt ferroborates; and alloys of cobalt with gadolinium, are promising materials for fabricating spin valves. Bifurcation diagrams of equations that describe the valve switching process are presented and analyzed. The four optimum switching modes of a valve are selected, based on an investigation of the dynamics of the magnetization vector. The magnitudes of the external magnetic field and controlling injection current that correspond to stable MRAM cell switching are compared for a variety of materials. The switching time of an MRAM cell is estimated numerically, and the conditions for its optimum speed are determined. It is established that the most promising materials for spin-valve fabrication are Fe40Co40B20 and Co80Gd20, annealed at 300 and 200°C, respectively.

Semiconductors. 2018;52(15):1982-1988
pages 1982-1988 views

Erratum

Erratum to: Nonuniversal Scaling Behavior of Conductivity Peak Widths in the Quantum Hall Effect in InGaAs/InAlAs Structures

Gudina S.V., Vasil’evskii I.S., Yakunin M.V., Shelushinina N.G., Podgornykh S.M., Savelyev A.P., Neverov V.N., Ilchenko E.V., Arapov Y.G., Vinichenko A.N.

Abstract

The name of the third author should read E. V. Ilchenko.

Semiconductors. 2018;52(15):1989-1989
pages 1989-1989 views

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