Optimization of the parameters of HEMT GaN/AlN/AlGaN heterostructures for microwave transistors using numerical simulation


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Abstract

The numerical simulation, and theoretical and experimental optimization of field-effect microwave high-electron-mobility transistors (HEMTs) based on GaN/AlN/AlGaN heterostructures are performed. The results of the study showed that the optimal thicknesses and compositions of the heterostructure layers, allowing high microwave power implementation, are in relatively narrow ranges. It is shown that numerical simulation can be efficiently applied to the development of microwave HEMTs, taking into account basic physical phenomena and features of actual device structures.

About the authors

V. G. Tikhomirov

Saint Petersburg Electrotechnical University “LETI”; Joint Stock Company “Svetlana-Electronpribor”

Author for correspondence.
Email: VV11111@yandex.ru
Russian Federation, ul. Prof. Popova 5, St. Petersburg, 197376; pr. Engelsa 27, korp. 164, St. Petersburg, 194021

V. E. Zemlyakov

Joint Stock Company “Svetlana-Electronpribor”; National Research University of Electronic Technology (MIET)

Email: VV11111@yandex.ru
Russian Federation, pr. Engelsa 27, korp. 164, St. Petersburg, 194021; 4806 proezd 5, Zelenograd, Moscow oblast, 124498

V. V. Volkov

Joint Stock Company “Svetlana-Electronpribor”

Email: VV11111@yandex.ru
Russian Federation, pr. Engelsa 27, korp. 164, St. Petersburg, 194021

Ya. M. Parnes

Joint Stock Company “Svetlana-Electronpribor”

Email: VV11111@yandex.ru
Russian Federation, pr. Engelsa 27, korp. 164, St. Petersburg, 194021

V. N. Vyuginov

Joint Stock Company “Svetlana-Electronpribor”

Email: VV11111@yandex.ru
Russian Federation, pr. Engelsa 27, korp. 164, St. Petersburg, 194021

W. V. Lundin

Submicron Heterostructures for Microelectronics Research and Engineering Center; Ioffe Physical–Technical Institute

Email: VV11111@yandex.ru
Russian Federation, ul. Politekhnicheskaya 26, St. Petersburg, 194021; ul. Politekhnicheskaya 26, St. Petersburg, 194021

A. V. Sakharov

Submicron Heterostructures for Microelectronics Research and Engineering Center; Ioffe Physical–Technical Institute

Email: VV11111@yandex.ru
Russian Federation, ul. Politekhnicheskaya 26, St. Petersburg, 194021; ul. Politekhnicheskaya 26, St. Petersburg, 194021

E. E. Zavarin

Submicron Heterostructures for Microelectronics Research and Engineering Center; Ioffe Physical–Technical Institute

Email: VV11111@yandex.ru
Russian Federation, ul. Politekhnicheskaya 26, St. Petersburg, 194021; ul. Politekhnicheskaya 26, St. Petersburg, 194021

A. F. Tsatsulnikov

Submicron Heterostructures for Microelectronics Research and Engineering Center; Ioffe Physical–Technical Institute

Email: VV11111@yandex.ru
Russian Federation, ul. Politekhnicheskaya 26, St. Petersburg, 194021; ul. Politekhnicheskaya 26, St. Petersburg, 194021

N. A. Cherkashin

CEMES-CNRS-Université de Toulouse

Email: VV11111@yandex.ru
France, 29 Rue Jeanne Marvig, Toulouse, 31055

M. N. Mizerov

Submicron Heterostructures for Microelectronics Research and Engineering Center

Email: VV11111@yandex.ru
Russian Federation, ul. Politekhnicheskaya 26, St. Petersburg, 194021

V. M. Ustinov

Ioffe Physical–Technical Institute

Email: VV11111@yandex.ru
Russian Federation, ul. Politekhnicheskaya 26, St. Petersburg, 194021


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