Features of the Temperature Dependence of the Specific Contact Resistance of Au–Ti–Pd–n+–n-Si Diffusion Silicon Structures
- Authors: Belyaev A.E.1, Boltovets N.S.2, Klad’ko V.P.1, Safryuk-Romanenko N.V.1, Lubchenko A.I.1, Sheremet V.N.1, Shynkarenko V.V.1, Slepova A.S.2, Pilipenko V.A.3, Petlitskaya T.V.3, Pilipchuk A.S.4, Konakova R.V.1, Sachenko A.V.1
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Affiliations:
- Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine
- State Enterprise Research Institute “Orion”
- OAO “INTEGRAL”—Holding Management Company
- Institute of Physics, National Academy of Sciences of Ukraine
- Issue: Vol 53, No 4 (2019)
- Pages: 469-476
- Section: Semiconductor Structures, Low-Dimensional Systems, and Quantum Phenomena
- URL: https://journals.rcsi.science/1063-7826/article/view/205950
- DOI: https://doi.org/10.1134/S1063782619040055
- ID: 205950
Cite item
Abstract
The temperature dependences of the specific contact resistance of silicon ρc with a doping step are measured experimentally and described theoretically. The measurements are performed in the temperature range from 4.2 to 380 K. It is established that the contacts of the studied Au–Ti–Pd–n+–n-Si structures are ohmic. It is shown that minimal ρc is implemented at T = 75 K. Its value rises both with a decrease in temperature (due to the freezing effect) and with an increase in temperature (due to the electron-enriched layer at the boundary with the bulk material). It is established that the bulk electron concentration strongly decreases in the near-contact region in a layer with a thickness on the order of one micron due to the compensation of silicon by deep acceptors appearing because of the formation of a rather high vacancy concentration during stress relaxation and the appearance of a high dislocation density, as well as due to their diffusion from the contact after heating to 450°C. The data on the occurrence of vacancy-type defects are confirmed by X-ray measurements. The dislocation density in the studied structures is also estimated from X-ray measurements.
About the authors
A. E. Belyaev
Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03028
N. S. Boltovets
State Enterprise Research Institute “Orion”
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03057
V. P. Klad’ko
Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03028
N. V. Safryuk-Romanenko
Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03028
A. I. Lubchenko
Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03028
V. N. Sheremet
Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03028
V. V. Shynkarenko
Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine
Author for correspondence.
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03028
A. S. Slepova
State Enterprise Research Institute “Orion”
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03057
V. A. Pilipenko
OAO “INTEGRAL”—Holding Management Company
Email: shynkarenko@gmail.com
Belarus, Minsk, 220108
T. V. Petlitskaya
OAO “INTEGRAL”—Holding Management Company
Email: shynkarenko@gmail.com
Belarus, Minsk, 220108
A. S. Pilipchuk
Institute of Physics, National Academy of Sciences of Ukraine
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03028
R. V. Konakova
Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03028
A. V. Sachenko
Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine
Email: shynkarenko@gmail.com
Ukraine, Kyiv, 03028