About the authors
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Author for correspondence.
Email: andrew@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021; St. Petersburg, 194021
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021; St. Petersburg, 194021
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021; St. Petersburg, 194021
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021; St. Petersburg, 194021
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021; St. Petersburg, 194021
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021; St. Petersburg, 194021
Ioffe Physical–Technical Institute
Email: andrew@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021
Ioffe Physical–Technical Institute; Submicron Heterostructures for Microelectronics, Research and Engineering Center
Email: andrew@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021; St. Petersburg, 194021
CEMES–CNRS—Université de Toulouse
Email: andrew@beam.ioffe.ru
France, Toulouse