Mikroèlektronika
ISSN 0544-1269 (Print)
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Author Details
Author Details
Efremov, A. M.
Issue
Section
Title
File
Vol 52, No 1 (2023)
ДИАГНОСТИКА
Controlling Silicon Etching Parameters in RF CHF3 Plasma by Optical Emission Spectroscopy
Vol 52, No 2 (2023)
ТЕХНОЛОГИЯ
Plasma Parameters and Kinetics of Reactive Ion Etching of SiO2 and Si3N4 in an HBr/Cl2/Ar Mixture
Vol 52, No 5 (2023)
ПЛАЗМЕННЫЕ ТЕХНОЛОГИИ
The Influence of Small F2, H2, and HF Additives on the Concentration of Active Particles in Tetrafluoromethane Plasma
Vol 52, No 4 (2023)
ПЛАЗМЕННЫЕ ТЕХНОЛОГИИ
Concentration of Fluorine Atoms and Kinetics of Reactive-Ion Etching of Silicon in CF4 + O2, CHF3 + O2, and C4F8 + O2 Mixtures
Vol 53, No 1 (2024)
ТЕХНОЛОГИИ
Parameters and Composition of Plasma in a Mixture of CF
4
+ H
2
+ Ar: Effect of the CF
4
/H
2
Ratio
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