Graphite/p-SiC Schottky Diodes Prepared by Transferring Drawn Graphite Films onto SiC


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Аннотация

Graphite/p-SiC Schottky diodes are fabricated using the recently suggested technique of transferring drawn graphite films onto p-SiC single-crystal substrates. The current–voltage and capacitance–voltage characteristics are measured at different temperatures and at different frequencies of a small-signal AC signal, respectively. The temperature dependences of the potential-barrier height and of the series resistance of the graphite/p-SiC junctions are measured and analyzed. The dominant mechanisms of the charge–carrier transport through the diodes are determined. It is shown that the dominant mechanisms of the transport of charge carriers through the graphite/p-Si Schottky diodes at a forward bias are multi-step tunneling recombination and tunneling described by the Newman formula (at high bias voltages). At reverse biases, the dominant mechanisms of charge transport are the Frenkel–Poole emission and tunneling. It is shown that the graphite/p-SiC Schottky diodes can be used as detectors of ultraviolet radiation since they have the open-circuit voltage Voc = 1.84 V and the short-circuit current density Isc = 2.9 mA/cm2 under illumination from a DRL 250-3 mercury–quartz lamp located 3 cm from the sample.

Об авторах

M. Solovan

Chernivtsi National University

Автор, ответственный за переписку.
Email: m.solovan@chnu.edu.ua
Украина, Chernivtsi, 58012

G. Andrushchak

Chernivtsi National University

Email: m.solovan@chnu.edu.ua
Украина, Chernivtsi, 58012

A. Mostovyi

Chernivtsi National University; Department of Chemical Physics

Email: m.solovan@chnu.edu.ua
Украина, Chernivtsi, 58012; Lund, 22100

T. Kovaliuk

Chernivtsi National University

Email: m.solovan@chnu.edu.ua
Украина, Chernivtsi, 58012

V. Brus

Institute for Silicon Photovoltaics

Email: m.solovan@chnu.edu.ua
Германия, Berlin, 12489

P. Maryanchuk

Chernivtsi National University

Email: m.solovan@chnu.edu.ua
Украина, Chernivtsi, 58012


© Pleiades Publishing, Ltd., 2018

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