Residual stresses in silicon and their evolution upon heat treatment and irradiation


Цитировать

Полный текст

Открытый доступ Открытый доступ
Доступ закрыт Доступ предоставлен
Доступ закрыт Только для подписчиков

Аннотация

The distributions of internal stresses in undoped and tin-doped silicon and the influence of electron irradiation with an energy of 5 MeV and of heat treatment at 450°C on the stresses are studied. The stresses are measured by a method based on the detection of birefringence by modulation polarimetry. It is shown that tin-doped silicon includes stripes of point defects with a nonuniform distribution of residual stresses of up to 20 kg cm–2. Heat treatment at 450°C induces an increase in the residual stresses in the sample to 50 kg cm–2. It is established that the radiation defects formed upon the irradiation of tin-doped silicon reduce the residual stresses to 2–3 kg cm–2.

Об авторах

I. Matyash

Lashkaryov Institute of Semiconductor Physics

Email: irinaminailiva125@gmail.com
Украина, Kyiv, 03028

I. Minailova

Lashkaryov Institute of Semiconductor Physics

Автор, ответственный за переписку.
Email: irinaminailiva125@gmail.com
Украина, Kyiv, 03028

B. Serdega

Lashkaryov Institute of Semiconductor Physics

Email: irinaminailiva125@gmail.com
Украина, Kyiv, 03028

L. Khirunenko

Institute of Physics

Email: irinaminailiva125@gmail.com
Украина, Kyiv, 03028


© Pleiades Publishing, Ltd., 2017

Данный сайт использует cookie-файлы

Продолжая использовать наш сайт, вы даете согласие на обработку файлов cookie, которые обеспечивают правильную работу сайта.

О куки-файлах