Simulation of the Qmax mode of a thermoelectric cooler taking into account thermal resistances at the cool and hot sides

Abstract

It is necessary to take into account the thermal resistances of structural components located between a material and a heat emitting medium (on the cold side) and between a material and a heat absorbing medium (on the hot side) when simulating thermoelectric cooling devices. A dimensionless mathematical model taking into account the mentioned thermal resistances and describing the cooling and heating capacity, voltage, and coefficient of performance of the devices, depending on current, is proposed in this study. Using this model, the optimal values of the current and thermal resistances on the hot and cold side of the devices can be found for implementation of the maximum cooling capacity mode and other operating conditions.