On a two-layer Si3N4/SiO2 dielectric mask for low-resistance ohmic contacts to AlGaN/GaN HEMTs


Cite item

Full Text

Open Access Open Access
Restricted Access Access granted
Restricted Access Subscription Access

Abstract

The fabrication of a two-layer Si3N4/SiO2 dielectric mask and features of its application in the technology of non-fired epitaxially grown ohmic contacts for high-power HEMTs on AlGaN/GaN heterostructures are described. The proposed Si3N4/SiO2 mask allows the selective epitaxial growth of heavily doped ohmic contacts by nitride molecular-beam epitaxy and the fabrication of non-fired ohmic contacts with a resistance of 0.15–0.2 Ω mm and a smooth surface and edge morphology.

About the authors

S. S. Arutyunyan

Institute of Ultrahigh Frequency Semiconductor Electronics; Institute of Microelectronics Technology and High-Purity Materials

Author for correspondence.
Email: spartakmain@gmail.com
Russian Federation, Moscow, 117105; Institutskaya ul. 6, Chernogolovka, Moscow oblast, 142432

A. Yu. Pavlov

Institute of Ultrahigh Frequency Semiconductor Electronics

Email: spartakmain@gmail.com
Russian Federation, Moscow, 117105

B. Yu. Pavlov

Institute of Ultrahigh Frequency Semiconductor Electronics

Email: spartakmain@gmail.com
Russian Federation, Moscow, 117105

K. N. Tomosh

Institute of Ultrahigh Frequency Semiconductor Electronics

Email: spartakmain@gmail.com
Russian Federation, Moscow, 117105

Yu. V. Fedorov

Institute of Ultrahigh Frequency Semiconductor Electronics

Email: spartakmain@gmail.com
Russian Federation, Moscow, 117105


Copyright (c) 2016 Pleiades Publishing, Ltd.

This website uses cookies

You consent to our cookies if you continue to use our website.

About Cookies