Specific features of doping with antimony during the ion-beam crystallization of silicon
- Authors: Pashchenko A.S.1, Chebotarev S.N.1, Lunin L.S.1, Irkha V.A.2
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Affiliations:
- Southern Scientific Center
- Special Engineering and Technology Department “Inversiya” Ltd.
- Issue: Vol 50, No 4 (2016)
- Pages: 545-548
- Section: Fabrication, Treatment, and Testing of Materials and Structures
- URL: https://journals.rcsi.science/1063-7826/article/view/197024
- DOI: https://doi.org/10.1134/S1063782616040199
- ID: 197024
Cite item
Abstract
A method of doping during the growth of thin films by ion-beam crystallization is proposed. By the example of Si and Sb, the possibility of controllably doping semiconductors during the ion-beam crystallization process is shown. A calibrated temperature dependence of the antimony vapor flow rate in the range from 150 to 400°C is obtained. It is established that, an increase in the evaporator temperature above 200°C brings about the accumulation of impurities in the layer growth direction. Silicon layers doped with antimony to a concentration of 1018 cm–3 are grown. It is shown that, as the evaporator temperature is increased, the efficiency of the activation of antimony in silicon nonlinearly decreases from ~100 to ~10–3.
About the authors
A. S. Pashchenko
Southern Scientific Center
Author for correspondence.
Email: as.pashchenko@gmail.com
Russian Federation, Rostov-on-Don, 344006
S. N. Chebotarev
Southern Scientific Center
Email: as.pashchenko@gmail.com
Russian Federation, Rostov-on-Don, 344006
L. S. Lunin
Southern Scientific Center
Email: as.pashchenko@gmail.com
Russian Federation, Rostov-on-Don, 344006
V. A. Irkha
Special Engineering and Technology Department “Inversiya” Ltd.
Email: as.pashchenko@gmail.com
Russian Federation, Rostov-on-Don, 344000