Experimental Evaluation of Reliability of Deep Submicron SOI MOS Transistors at High Temperatures
- Авторы: Benediktov A.S.1, Shelepin N.A.1, Ignatov P.V.1
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Учреждения:
- Molecular Electronics Research Institute (MERI)
- Выпуск: Том 47, № 3 (2018)
- Страницы: 217-220
- Раздел: Article
- URL: https://journals.rcsi.science/1063-7397/article/view/186843
- DOI: https://doi.org/10.1134/S1063739718030034
- ID: 186843
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Аннотация
In this paper, 0.18–0.5 μm SOI MOS transistors are tested for compliance with the reliability criteria applied to high-temperature electronics and their components. The main parameters of SOI MOS transistors are measured in the temperature range from −60 to +300°С. The specific behavior exhibited by SOI MOS transistors at high temperatures should be taken into account when designing high-temperature integrated circuits so as to avoid premature failures and increase the reliability of devices.
Об авторах
A. Benediktov
Molecular Electronics Research Institute (MERI)
Автор, ответственный за переписку.
Email: asb_sm@mail.ru
Россия, Zelenograd, Moscow, 124460
N. Shelepin
Molecular Electronics Research Institute (MERI)
Email: asb_sm@mail.ru
Россия, Zelenograd, Moscow, 124460
P. Ignatov
Molecular Electronics Research Institute (MERI)
Email: asb_sm@mail.ru
Россия, Zelenograd, Moscow, 124460
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