Mikroèlektronika
ISSN 0544-1269 (Print)
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Betelin, V.
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Vol 52, No 2 (2023)
ТЕХНОЛОГИЯ
Plasma Parameters and Kinetics of Reactive Ion Etching of SiO2 and Si3N4 in an HBr/Cl2/Ar Mixture
Vol 52, No 5 (2023)
ПЛАЗМЕННЫЕ ТЕХНОЛОГИИ
The Influence of Small F2, H2, and HF Additives on the Concentration of Active Particles in Tetrafluoromethane Plasma
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