Impact of the Graded-Gap Layer on the Admittance of MIS Structures Based on MBE-Grown n-Hg1 – xCdxTe (x = 0.22–0.23) with the Al2O3 Insulator
- Авторы: Voitsekhovskii A.V.1, Nesmelov S.N.1, Dzyadukh S.M.1, Vasil’ev V.V.2, Varavin V.S.2, Dvoretsky S.A.1,2, Mikhailov N.N.2, Yakushev M.V.2, Sidorov G.Y.2
 - 
							Учреждения: 
							
- National Research Tomsk State University
 - Institute of Semiconductor Physics, Siberian Branch
 
 - Выпуск: Том 63, № 3 (2018)
 - Страницы: 281-284
 - Раздел: Articles from the Russian Journal Prikladnaya Fizika
 - URL: https://journals.rcsi.science/1064-2269/article/view/199580
 - DOI: https://doi.org/10.1134/S106422691803021X
 - ID: 199580
 
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Аннотация
The impact of the presence of the near-surface graded-gap layers with an increased content of CdTe on the admittance of MIS structures based on MBE-grown n-Hg1–xCdxTe (x = 0.22–0.23) with the Al2O3 insulating coating has been experimentally studied. It has been shown that the structures with a gradedgap layer are characterized by a deeper and wider capacitance dip in the low-frequency capacitance–voltage (CV) characteristic and by higher values of the differential resistance of the space-charge region than the structures without such a layer. It has been found that the main features of the hysteresis of capacitance dependences typical of the graded-gap structures with SiO2/Si3N4 are also characteristic of the MIS structures with the Al2O3 insulator. The factors that cause an increase in the CV characteristic hysteresis upon formation of the graded-gap layer in structures with SiO2/Si3N4 or Al2O3 are still debatable, although it may be assumed that oxygen plays a certain role in formation of this hysteresis.
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Об авторах
A. Voitsekhovskii
National Research Tomsk State University
							Автор, ответственный за переписку.
							Email: vav43@mail.tsu.ru
				                					                																			                												                	Россия, 							Tomsk, 634050						
S. Nesmelov
National Research Tomsk State University
														Email: vav43@mail.tsu.ru
				                					                																			                												                	Россия, 							Tomsk, 634050						
S. Dzyadukh
National Research Tomsk State University
														Email: vav43@mail.tsu.ru
				                					                																			                												                	Россия, 							Tomsk, 634050						
V. Vasil’ev
Institute of Semiconductor Physics, Siberian Branch
														Email: vav43@mail.tsu.ru
				                					                																			                												                	Россия, 							Novosibirsk, 630090						
V. Varavin
Institute of Semiconductor Physics, Siberian Branch
														Email: vav43@mail.tsu.ru
				                					                																			                												                	Россия, 							Novosibirsk, 630090						
S. Dvoretsky
National Research Tomsk State University; Institute of Semiconductor Physics, Siberian Branch
														Email: vav43@mail.tsu.ru
				                					                																			                												                	Россия, 							Tomsk, 634050; Novosibirsk, 630090						
N. Mikhailov
Institute of Semiconductor Physics, Siberian Branch
														Email: vav43@mail.tsu.ru
				                					                																			                												                	Россия, 							Novosibirsk, 630090						
M. Yakushev
Institute of Semiconductor Physics, Siberian Branch
														Email: vav43@mail.tsu.ru
				                					                																			                												                	Россия, 							Novosibirsk, 630090						
G. Sidorov
Institute of Semiconductor Physics, Siberian Branch
														Email: vav43@mail.tsu.ru
				                					                																			                												                	Россия, 							Novosibirsk, 630090						
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