Focal plane arrays mesastructures formation by ion-beam etching


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Abstract

The results of investigation of profiles formed by ion-beam etching of semiconductor structures through a photolithographic mask are presented. The minimum dimensions of unmasked regions on the surfaces of two studied structures are 2 and 5 μm, respectively. It is demonstrated that the etching rate reduces with reduction in the width of the unmasked gap. The effect of reflection of the ion beam from vertical walls formed during etching may be used for fabrication of submicron separating mesaregions.

About the authors

M. V. Sednev

OAO NPO Orion

Author for correspondence.
Email: orion@orion-ir.ru
Russian Federation, ul. Kosinskaya 9, Moscow, 111538

K. O. Boltar

OAO NPO Orion; Moscow Institute of Physics and Technology (State University)

Email: orion@orion-ir.ru
Russian Federation, ul. Kosinskaya 9, Moscow, 111538; Institutskii per. 9, Dolgoprudnyi, Moscow oblast, 141700

Yu. P. Sharonov

OAO NPO Orion

Email: orion@orion-ir.ru
Russian Federation, ul. Kosinskaya 9, Moscow, 111538

A. A. Lopukhin

OAO NPO Orion

Email: orion@orion-ir.ru
Russian Federation, ul. Kosinskaya 9, Moscow, 111538


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