Device-Technological Modeling of Integrated Circuit Elements with Improved Resilience to External Influences

Y. A. Chaplygin; T. Y. Krupkina; A. Y. Krasukov; E. A. Artamonova

doi:10.1134/S1063739717070046

Device-Technological Modeling of Integrated Circuit Elements with Improved Resilience to External Influences

作者: Chaplygin Y.A.¹, Krupkina T.Y.¹, Krasukov A.Y.¹, Artamonova E.A.¹
隶属关系:
1. National Research University of Electronic Technology
期: 卷 46, 编号 7 (2017)
页面: 474-477
栏目: Article
URL: https://journals.rcsi.science/1063-7397/article/view/186639
DOI: https://doi.org/10.1134/S1063739717070046
ID: 186639

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详细

This paper analyzes some features of the process and device simulation tools. The tools are analyzed as applied to the calculation of electrical characteristics for several integrated circuit (IC) devices operating under different external conditions. The model features having the maximum effect on the simulation results are identified.