Device-Technological Modeling of Integrated Circuit Elements with Improved Resilience to External Influences
- Autores: Chaplygin Y.A.1, Krupkina T.Y.1, Krasukov A.Y.1, Artamonova E.A.1
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Afiliações:
- National Research University of Electronic Technology
- Edição: Volume 46, Nº 7 (2017)
- Páginas: 474-477
- Seção: Article
- URL: https://journals.rcsi.science/1063-7397/article/view/186639
- DOI: https://doi.org/10.1134/S1063739717070046
- ID: 186639
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Resumo
This paper analyzes some features of the process and device simulation tools. The tools are analyzed as applied to the calculation of electrical characteristics for several integrated circuit (IC) devices operating under different external conditions. The model features having the maximum effect on the simulation results are identified.
Sobre autores
Y. Chaplygin
National Research University of Electronic Technology
Email: a_kras@org.miet.ru
Rússia, Moscow
T. Krupkina
National Research University of Electronic Technology
Email: a_kras@org.miet.ru
Rússia, Moscow
A. Krasukov
National Research University of Electronic Technology
Autor responsável pela correspondência
Email: a_kras@org.miet.ru
Rússia, Moscow
E. Artamonova
National Research University of Electronic Technology
Email: a_kras@org.miet.ru
Rússia, Moscow
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