Formation of Two-Component Vertical Contact Structures for Mounting Integrated-Circuit Chips

V. M. Roshchin; I. N. Petukhov; K. S. Sen’chenko; A. V. Roshchina; T. V. Shilina

doi:10.1134/S1063739717070095

Formation of Two-Component Vertical Contact Structures for Mounting Integrated-Circuit Chips

Authors: Roshchin V.M.¹, Petukhov I.N.¹, Sen’chenko K.S.¹, Roshchina A.V.¹, Shilina T.V.¹
Affiliations:
1. National Research University of Electronic Technology (MIET)
Issue: Vol 46, No 7 (2017)
Pages: 454-457
Section: Article
URL: https://journals.rcsi.science/1063-7397/article/view/186614
DOI: https://doi.org/10.1134/S1063739717070095
ID: 186614

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Abstract

The technological capabilities of the layer-by-layer electrochemical formation of vertical contact structures based on a copper–tin system for mounting silicon chips, including 3D technologies, have been considered. The possibility of fixing a chip–board clearance for the preventing a short circuit between the contact areas with the solder material has been shown.