Formation of Two-Component Vertical Contact Structures for Mounting Integrated-Circuit Chips
- Autores: Roshchin V.1, Petukhov I.1, Sen’chenko K.1, Roshchina A.1, Shilina T.1
-
Afiliações:
- National Research University of Electronic Technology (MIET)
- Edição: Volume 46, Nº 7 (2017)
- Páginas: 454-457
- Seção: Article
- URL: https://journals.rcsi.science/1063-7397/article/view/186614
- DOI: https://doi.org/10.1134/S1063739717070095
- ID: 186614
Citar
Resumo
The technological capabilities of the layer-by-layer electrochemical formation of vertical contact structures based on a copper–tin system for mounting silicon chips, including 3D technologies, have been considered. The possibility of fixing a chip–board clearance for the preventing a short circuit between the contact areas with the solder material has been shown.
Sobre autores
V. Roshchin
National Research University of Electronic Technology (MIET)
Email: OFH.MIET@yandex.ru
Rússia, Zelenograd, Moscow
I. Petukhov
National Research University of Electronic Technology (MIET)
Autor responsável pela correspondência
Email: OFH.MIET@yandex.ru
Rússia, Zelenograd, Moscow
K. Sen’chenko
National Research University of Electronic Technology (MIET)
Email: OFH.MIET@yandex.ru
Rússia, Zelenograd, Moscow
A. Roshchina
National Research University of Electronic Technology (MIET)
Email: OFH.MIET@yandex.ru
Rússia, Zelenograd, Moscow
T. Shilina
National Research University of Electronic Technology (MIET)
Email: OFH.MIET@yandex.ru
Rússia, Zelenograd, Moscow