Features of Electroforming and Functioning of Memristors Based on Open TiN–SiO2–Mo Sandwich Structures

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Abstract

The processes of electroforming and functioning in a vacuum of memristors (elements of non-volatile electrically reprogrammable memory) based on open TiN–SiO2–Mo sandwich structures were studied. The experimental results showed that, firstly, these structures with a top molybdenum electrode are characterized by higher initial conductivity values than the previously studied TiN–SiO2–W structures. Secondly, for structures with Mo it turned out to be possible to reduce the electroforming voltage to values of 6–8 V, which is almost two times lower than for structures with W under the same experimental conditions. This increases the reliability of the functioning of memory elements, minimizing the likelihood of breakdown. Experiments with preliminary thermal annealing of open TiN–SiO2–Mo sandwich structures in an oil-free vacuum showed that the structures retained high initial conductivity, but did not undergo full electroforming. Based on the results obtained, a mechanism for the appearance of high built-in conductivity for open TiN–SiO2–Mo sandwich structures was proposed, which is based on the transfer of molybdenum atoms through the etchant to the open edge of SiO2 during its fabrication.

About the authors

E. S. Gorlachev

Yaroslavl Branch of the Valiev Institute of Physics and Technology, Russian Academy of Sciences

Author for correspondence.
Email: egorlachev@yandex.ru
Russian Federation, Yaroslavl

V. M. Mordvintsev

Yaroslavl Branch of the Valiev Institute of Physics and Technology, Russian Academy of Sciences

Email: egorlachev@yandex.ru
Russian Federation, Yaroslavl

S. E. Kudryavtsev

Yaroslavl Branch of the Valiev Institute of Physics and Technology, Russian Academy of Sciences

Email: egorlachev@yandex.ru
Russian Federation, Yaroslavl

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Supplementary files

Supplementary Files
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1. JATS XML
2. Fig. 1. Schematic representation of open "sandwich"-MDM-structure after electroforming: 1 - lower electrode (TiN); 2 - dielectric (SiO2) with thickness about 20 nm; 3 - upper electrode (cathode) (Mo, W, TiN); 4 - conducting nanostructure; 5 - insulating gap with variable width h ≈ 1 nm

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3. Fig. 2. Typical VAC of the open "sandwich" structure TiN-SiO2-Mo when a triangular pulse with the amplitude of 10 V is applied: a - initial "on" state; b - successful electroforming of the same structure after its switching off by a short pulse with the amplitude of 8 V; c - after working up of the structure by a pulse with the amplitude of 10 V

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4. Fig. 3. Typical VAC of the electroforming process of an open TiN-SiO2-Mo "sandwich" structure in the absence of the initial "on" state and the triangular pulse amplitude of 10 V

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5. Fig. 4. Typical VAC of an open TiN-SiO2-Mo sandwich structure after annealing in a high oil-free vacuum of 200°C for 60 min and turning it off with a short voltage pulse of 9 V amplitude

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6. Fig. 5. Typical VAC of the electroforming process of an open TiN-SiO2-Mo sandwich structure at a triangular pulse amplitude of 8 V

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7. Fig. 6. Voltampere characteristic of the electroforming process of the open "sandwich" structure TiN-SiO2-Mo at the triangular pulse amplitude of 6 V

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