Email this article The Effect of an N2 Additive on the GaAs Etching Rate in CF2Cl2 Plasma
- Authors: Pivovarenok S.A.1
-
Affiliations:
- Research Institute of Thermodynamics and Kinetics of Chemical Processes, Ivanovo State University of Chemistry and Technology
- Issue: Vol 48, No 4 (2019)
- Pages: 236-239
- Section: Article
- URL: https://journals.rcsi.science/1063-7397/article/view/187145
- DOI: https://doi.org/10.1134/S1063739719030089
- ID: 187145
Cite item
Open Access
Access granted
Subscription Access
Abstract
The kinetics of GaAs etching in CF2Cl2 and CF2Cl2/N2 is investigated. It is shown that the shape of the dependences of the etching rate on the gas flow rate is determined by the energy of the ions bombarding the treated surface. It is demonstrated that, when a plasma-forming gas is diluted in a ratio of 1/1, the etching rate of the sample decreases by a factor of approximately 1.6. An increase in power (Wrf or Wbias) leads to significant changes in the GaAs etching rate.
Keywords
About the authors
S. A. Pivovarenok
Research Institute of Thermodynamics and Kinetics of Chemical Processes,Ivanovo State University of Chemistry and Technology
Author for correspondence.
Email: sap@isuct.ru
Russian Federation, Ivanovo, 153000
Supplementary files
