On the effect of lead concentration on the kinetics of contact melting in the Sn–Pb–Bi system in the presence of electromigration

V. Z. Afashokov; A. A. Akhkubekov; S. N. Akhkubekova; M.-A. V. Zubkhadjiev; B. M. Khubolov

doi:10.1134/S1027451016040030

On the effect of lead concentration on the kinetics of contact melting in the Sn–Pb–Bi system in the presence of electromigration

Authors: Afashokov V.Z.¹, Akhkubekov A.A.¹, Akhkubekova S.N.¹, Zubkhadjiev M.V.¹, Khubolov B.M.¹
Affiliations:
1. Kabardino-Balkarian State University
Issue: Vol 10, No 4 (2016)
Pages: 763-766
Section: Article
URL: https://journals.rcsi.science/1027-4510/article/view/189271
DOI: https://doi.org/10.1134/S1027451016040030
ID: 189271

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Abstract

It is determined by electron microscopy that the contact layer in the Sn–(Bi + 30 wt % Pb) system contains separate solid inclusions, while the contact layer in the Sn–(Bi + 40 wt % Pb) system is microheterogeneous. The observed structural states of alloys in the contact layers are explained by a change in the concentration of the initial contacting samples. The effect of the alloy structure and electromigration on the kinetics of contact melting is found.