On the effect of lead concentration on the kinetics of contact melting in the Sn–Pb–Bi system in the presence of electromigration

Аннотация

It is determined by electron microscopy that the contact layer in the Sn–(Bi + 30 wt % Pb) system contains separate solid inclusions, while the contact layer in the Sn–(Bi + 40 wt % Pb) system is microheterogeneous. The observed structural states of alloys in the contact layers are explained by a change in the concentration of the initial contacting samples. The effect of the alloy structure and electromigration on the kinetics of contact melting is found.