Thermal Contact Resistance at Cryogenic Temperatures in the Presence of Strong Magnetic Fields

K. A.  Kolesov; Колесов К. А.; A. V. Mashirov; Маширов А. В.; A. S. Kuznetsov; Кузнецов А. С.; V. V. Koledov; Коледов В. В.; A. O. Petrov; Петров А. О.; V. G. Shavrov; Шавров В. Г.

doi:10.31857/S0033849423040058

Thermal Contact Resistance at Cryogenic Temperatures in the Presence of Strong Magnetic Fields

Авторлар: Kolesov K.¹, Mashirov A.¹, Kuznetsov A.¹, Koledov V.¹, Petrov A.¹, Shavrov V.¹
Мекемелер:
1. Kotelnikov Institute of Radioengineering and Eletcronics, Russian Academy of Sciences
Шығарылым: Том 68, № 4 (2023)
Беттер: 360-365
Бөлім: К 90-ЛЕТИЮ ВЛАДИМИРА ГРИГОРЬЕВИЧА ШАВРОВА
URL: https://journals.rcsi.science/0033-8494/article/view/138192
DOI: https://doi.org/10.31857/S0033849423040058
EDN: https://elibrary.ru/PEZNZB
ID: 138192

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Аннотация
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Әдебиет тізімі
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Аннотация

A physical model of a mechanical thermal switch at cryogenic temperatures is studied. In the model, heat is transferred due to contact heat conduction in a detachable contact pair of two copper cylinders. A mechanical thermal switch is developed using a cryomagnetic system with a 10-T superconducting solenoid, and the values of thermal contact conductance are determined in a temperature interval of 10–160 K, including values at a magnetic field of 5 T. In an experimental temperature interval of 60–80 K, close to the phase transition of the DyAl2 and GdNi2 compounds, the thermal contact conductance is 2300–3300 W/(m2 K). The effect of magnetic field of up to 5 T on thermal contact resistance is experimentally determined under vacuum conditions

Негізгі сөздер

mechanical thermal switch, thermal contact conductance

Әдебиет тізімі

Klinar K., Swoboda T., Munoz M., Kitanovski A. // Adv. Electronic Mater. 2021. V. 7. № 3. Article No. 2000623. https://doi.org/10.1002/aelm.202000623
Lambert M.A., Fletcher L.S. // J. Thermophysics Heat Transfer. 1997. V. 11. № 2. P. 129. https://doi.org/10.2514/2.6221
Xian Y., Zhang P., Zhai et al. // Appl. Therm. Engineering. 2018. V. 130. P. 1530. https://doi.org/10.1016/j.applthermaleng.2017.10.163
Clausing A.M., Chao B.T. // J. Heat Transfer. 1965. V. 87. № 2. P. 243. https://doi.org/10.1115/1.3689082
Bahrami M., Culham J.R., Yananovich M.M., Schneider G.E. // Appl. Mechanics Rev. 2006. V. 59. № 1. P. 1. https://doi.org/10.1115/1.2110231
Tariq A., Asif M. // Heat Mass Transfer. 2016. V. 52. № 2. P. 291. https://doi.org/10.1007/s00231-015-1551-1
Drobizhev A., Reiten J., Singh V., Kolomensky Y.G. // Cryogenics. 2017. V. 85. P. 63. https://doi.org/10.1016/j.cryogenics.2017.05.008
Попов В.М. Теплообмен в зоне контакта разъемных и неразъемных соединений. М.: Энергия, 1971.
Gmelin E., Asen-Palmer M., Reuther M., Villar R. // J. Phys. D: Appl. Phys. 1999. V. 32. № 6. R19. https://doi.org/10.1088/0022-3727/32/6/004
Koshkid’ko Yu.S., Dilmieva E.T. et al. // J. Alloys Compounds. 2022. V. 904. Article No. 164051. https://doi.org/10.1016/j.jallcom.2022.164051
Кошкидько Ю.С., Дильмиева Э.Т., Каманцев А.П. и др. // РЭ. 2023. Т. 68. № 4. С.
Fukuoka T., Nomura M. // J. Pressure Vessel Technol. 2013. V. 135. № 2. P. 021403. https://doi.org/10.1115/1.4007958
Berman R., MacDonald D. // Proc. Royal Soc. A: Math., Phys., Engineering Sci. 1952. V. 211. № 1104. P. 122. https://doi.org/10.1098/rspa.1952.0029