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Vol 45, No 6 (2016)

Article

Experimental diamond photonics: Current state and prospects. Part II

Tsukanov A.V., Kateev I.Y.

Abstract

The technique for fabricating microcavities from diamond and other materials is described and their main parameters are reported. The possibilities of using color centers in diamond which interact with optical cavities as single-phonon sources and in quantum information processing are discussed. Several variants of integration of the color centers with high-Q cavities are considered.

Russian Microelectronics. 2016;45(6):367-382
pages 367-382 views

Integration of functional elements of resistive nonvolative memory with 1T-1R topology

Negrov D.V., Kirtaev R.V., Kiseleva I.V., Kondratyuk E.V., Shadrin A.V., Zenkevich A.V., Orlov O.M., Gornev E.S., Krasnikov G.Y.

Abstract

The issues related to the integration of functional elements of ReRAM memory based on resistive Pt/HfO2/TiN structures with transistors fabricated by CMOS technology (0.18 μm node) are discussed when placing the memory cells in metallization layers. It is shown that the formation of a ReRAM stack can be organized as the “back end of line” (BEOL) process. The possibility is demonstrated of writing information in fabricated 1T-1R cells at the given levels of current determined by the voltage on the transistor, which allows one to choose the required values of resistance for the ON and OFF states. The presence of a transistor makes it possible to limit the power that is scattered in a resistance-switchable structure, and makes its parameters virtually insensitive to changes in the voltage of writing. The latter circumstance makes it possible to use the same recording voltage for all devices, which makes the problem of reproducing the values for different cells in an array less acute.

Russian Microelectronics. 2016;45(6):383-395
pages 383-395 views

Electrical properties of a TiN/TixAl1 – xOy/TiN memristor device manufactured by magnetron sputtering

Bobylev A.N., Udovichenko S.Y.

Abstract

A memristor device with an active layer of mixed metal oxide has been manufactured using reactive magnetron sputtering and electron lithography. The device’s electrical characteristics, such as the switching voltage and resistances in the low-resistance (LRS) and high-resistance (HRS) states, are stable and they a high resistance ratio in these states. The electrical properties of the device, which are similar to those of a living synapse by neural pulse propagation, have been determined. The possibility of the memristor application as a summing element of an artificial neuron is shown. The large value of the high-to-low resistance ratio and minor variation of the electrical characteristics make it possible to use the device in the neuromorphic computing systems.

Russian Microelectronics. 2016;45(6):396-401
pages 396-401 views

Mo/Al/Mo/Au-based ohmic contacts to AlGaN/GaN heterostructures

Kondakov M.N., Chernykh S.V., Chernykh A.V., Gladysheva N.B., Dorofeev A.A., Didenko S.I., Shcherbachev K.D., Tabachkova N.Y., Kaprov D.B.

Abstract

Mo/Al/Mo/Au metallization scheme as an ohmic contact to undoped AlGaN/GaN heterostructures was investigated. The optimal thicknesses of the metal layers were determined: Mo (10 nm)/Al (60 nm)/ Mo (50 nm)/Au (50 nm). The specific contact resistance of the fabricated ohmic contact is 4.7 × 10–7 Ohm cm2 (0.14 Ohm mm). The microstructure of the contact after annealing was investigated using scanning and transmission electron microscopy, X-ray diffractometry and energy-dispersive X-ray spectroscopy. It is shown that a noticeable alloying of metallization into semiconductor upon annealing does not occur, but strong mixing of metals takes place. X-ray diffraction analysis demonstrated the presence of interfacial compounds, namely, Al2Au, Al3 + xMo1–x, AlMo3, Al12Mo, GaMo3 and GaAu2. Investigations of the phase composition of films depending on the thickness ratio of the metallization layers have shown that the formation of Al2Au phase has a negative effect on the contact surface morphology, and the formation of GaMo3, AlxMoy phases likely plays the most important role in the ohmic contact formation, which was also confirmed by the method of energy-dispersive analysis.

Russian Microelectronics. 2016;45(6):402-409
pages 402-409 views

Ways of increasing the service life of positive photoresists

Lebedev V.I., Kotomina V.E., Zelentsov S.V.

Abstract

The change in the functional properties of positive photoresists during their storage is a serious issue in photolithography. The recovery of the functional properties of photoresists, and especially, the quality of the edge of the formed elements and changes in their sizes compared to the sizes in the photostencil, is possible by the introduction of additives into the composition of positive photoresists which form hydrogen bonds with the novolak resins constituting them prior to their usage. Experimental verification of the correlation between the density of the hydrogen bonds and the photoresist resolution has been obtained.

Russian Microelectronics. 2016;45(6):410-413
pages 410-413 views

Simulation of mass transfer of liquids through microchannels under the influence of surface acoustic waves

Sirotkin V.V.

Abstract

Parametric research of the mass transfer of liquids through flat microchannels under the influence of surface acoustic waves was performed using numeric simulation.

Russian Microelectronics. 2016;45(6):414-418
pages 414-418 views

Upset-resilient RAM on STG DICE memory elements with the spaced transistors into two groups

Stenin V.Y., Katunin Y.V., Stepanov P.V.

Abstract

The first experimental test of new DICE memory cells with the transistors spaced into two groups (Spaced Transistor Groups DICE—STG DICE), composed on a 65-nm CMOS static RAM proved their high upset resilience. The STG DICE memory cells have two communication wires between the two groups of transistors that made it possible to use the striping of groups of transistors to increase the distances between sensitive nodes of cells up to 2.32–3.09 μm at a small increase in cell area. The blocks of 65-nm 128 × 32-bit CMOS RAM cache and 32 × 64-bit multiport RAM based on the STG DICE cells are characterized by upset thresholds lying in the range of 3.55–4.05 nJ of the laser pulse energy with a pulse duration of 70 ps and diameter of the spot of 3.5 μm. These threshold values exceed the upset thresholds of 65-nm CMOS RAM on 6T memory cells by factors of 20 for RAM cache and 3.5 for multiport RAM. In STG DICE RAM multiple upsets are absent in contrast to RAM based on 6T-cells.

Russian Microelectronics. 2016;45(6):419-432
pages 419-432 views

Influence of external conditions on physical processes and plasma parameters in a model of a high-frequency hybrid plasma system

Aleksandrov A.F., Petrov A.K., Vavilin K.V., Kral’kina E.A., Neklyudova P.A., Nikonov A.M., Pavlov V.B., Airapetov A.A., Odinokov V.V., Pavlov G.Y., Sologub V.A.

Abstract

The results of the experimental investigation into parameters of the helicon discharge plasma in a model of high-frequency hybrid plasma system equipped with a solenoidal antenna are presented. It is shown that an increase in the external magnetic field causes the formation of the plasma column and the displacement of the ion current over the discharge axis towards the lower model flange. The variation in the magnetic field configuration makes it possible to control the shape of the plasma column.

Russian Microelectronics. 2016;45(6):433-441
pages 433-441 views

Smart fiber-optical sensor of acoustic pressure with a possibility of distant correction of sensitivity

Egorov F.A., Amelichev V.V., Generalov S.S., Nikiforov S.V., Shamanaev S.V., Goldberg Y.V.

Abstract

A method for the self-calibration of a remote fiber-optic hydrophone (FOH) providing the maximum sensitivity of the sensor in harsh exploitation conditions is proposed. The method is based on the periodic remote control of the current values of the key parameters characterizing the elastic and mechanical properties of the sensor element-micromembrane and optical properties of the measuring Fabry-Perot interferometer that determine the FOH sensitivity at large.

Russian Microelectronics. 2016;45(6):442-445
pages 442-445 views

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