Structural Strength and Temperature Condition of Multi-Chip Modules
- Authors: Pogalov A.I.1, Blinov G.A.1, Chugunov E.Y.1
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Affiliations:
- National Research University of Electronic Technology
- Issue: Vol 47, No 7 (2018)
- Pages: 460-464
- Section: Article
- URL: https://journals.rcsi.science/1063-7397/article/view/186953
- DOI: https://doi.org/10.1134/S1063739718070090
- ID: 186953
Cite item
Abstract
The general principles of designing three-dimensional multichip modules are presented. The multichip modules are simulated and the effect of the design variables on the strength and temperature condition of the products is studied. The values of thermomechanical stresses, heat resistance, and overheating temperatures of the materials are determined, and the heat removal efficiency in various structural variations of three-dimensional modules is also found. Methods for providing an intensive heat transfer in the structures of the modules and increasing the strength consistency of the products are developed. Recommendations on the design of multichip modules are given.
About the authors
A. I. Pogalov
National Research University of Electronic Technology
Email: Chugunov-EU@inbox.ru
Russian Federation, Moscow
G. A. Blinov
National Research University of Electronic Technology
Email: Chugunov-EU@inbox.ru
Russian Federation, Moscow
E. Yu. Chugunov
National Research University of Electronic Technology
Author for correspondence.
Email: Chugunov-EU@inbox.ru
Russian Federation, Moscow