Prospects for Boiling of Subcooled Dielectric Liquids for Supercomputer Cooling


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Аннотация

It is shown experimentally that using forced-convection boiling of dielectric coolants of the Novec 649 Refrigerant subcooled relative to the saturation temperature makes possible removing heat flow rates up to 100 W/cm2 from modern supercomputer chip interface. This fact creates prerequisites for the application of dielectric liquids in cooling systems of modern supercomputers with increased requirements for their operating reliability.

Авторлар туралы

Yu. Zeigarnik

Joint Institute for High Temperatures

Email: ikalmykov@rambler.ru
Ресей, Moscow

N. Vasil’ev

Joint Institute for High Temperatures; Bauman Moscow State Technical University (National Research University)

Email: ikalmykov@rambler.ru
Ресей, Moscow; Moscow

E. Druzhinin

ZAO RSK Technologies

Email: ikalmykov@rambler.ru
Ресей, Moscow

I. Kalmykov

Joint Institute for High Temperatures

Хат алмасуға жауапты Автор.
Email: ikalmykov@rambler.ru
Ресей, Moscow

A. Kosoi

Joint Institute for High Temperatures

Email: ikalmykov@rambler.ru
Ресей, Moscow

K. Khodakov

Joint Institute for High Temperatures

Email: ikalmykov@rambler.ru
Ресей, Moscow

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