Prospects for Boiling of Subcooled Dielectric Liquids for Supercomputer Cooling
- Авторлар: Zeigarnik Y.A.1, Vasil’ev N.V.1,2, Druzhinin E.A.3, Kalmykov I.V.1, Kosoi A.S.1, Khodakov K.A.1
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Мекемелер:
- Joint Institute for High Temperatures
- Bauman Moscow State Technical University (National Research University)
- ZAO RSK Technologies
- Шығарылым: Том 63, № 2 (2018)
- Беттер: 58-60
- Бөлім: Physics
- URL: https://journals.rcsi.science/1028-3358/article/view/192683
- DOI: https://doi.org/10.1134/S102833581802012X
- ID: 192683
Дәйексөз келтіру
Аннотация
It is shown experimentally that using forced-convection boiling of dielectric coolants of the Novec 649 Refrigerant subcooled relative to the saturation temperature makes possible removing heat flow rates up to 100 W/cm2 from modern supercomputer chip interface. This fact creates prerequisites for the application of dielectric liquids in cooling systems of modern supercomputers with increased requirements for their operating reliability.
Авторлар туралы
Yu. Zeigarnik
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
Ресей, Moscow
N. Vasil’ev
Joint Institute for High Temperatures; Bauman Moscow State Technical University (National Research University)
Email: ikalmykov@rambler.ru
Ресей, Moscow; Moscow
E. Druzhinin
ZAO RSK Technologies
Email: ikalmykov@rambler.ru
Ресей, Moscow
I. Kalmykov
Joint Institute for High Temperatures
Хат алмасуға жауапты Автор.
Email: ikalmykov@rambler.ru
Ресей, Moscow
A. Kosoi
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
Ресей, Moscow
K. Khodakov
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
Ресей, Moscow
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