Prospects for Boiling of Subcooled Dielectric Liquids for Supercomputer Cooling
- 作者: Zeigarnik Y.A.1, Vasil’ev N.V.1,2, Druzhinin E.A.3, Kalmykov I.V.1, Kosoi A.S.1, Khodakov K.A.1
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隶属关系:
- Joint Institute for High Temperatures
- Bauman Moscow State Technical University (National Research University)
- ZAO RSK Technologies
- 期: 卷 63, 编号 2 (2018)
- 页面: 58-60
- 栏目: Physics
- URL: https://journals.rcsi.science/1028-3358/article/view/192683
- DOI: https://doi.org/10.1134/S102833581802012X
- ID: 192683
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详细
It is shown experimentally that using forced-convection boiling of dielectric coolants of the Novec 649 Refrigerant subcooled relative to the saturation temperature makes possible removing heat flow rates up to 100 W/cm2 from modern supercomputer chip interface. This fact creates prerequisites for the application of dielectric liquids in cooling systems of modern supercomputers with increased requirements for their operating reliability.
作者简介
Yu. Zeigarnik
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow
N. Vasil’ev
Joint Institute for High Temperatures; Bauman Moscow State Technical University (National Research University)
Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow; Moscow
E. Druzhinin
ZAO RSK Technologies
Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow
I. Kalmykov
Joint Institute for High Temperatures
编辑信件的主要联系方式.
Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow
A. Kosoi
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow
K. Khodakov
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow
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