Prospects for Boiling of Subcooled Dielectric Liquids for Supercomputer Cooling


如何引用文章

全文:

开放存取 开放存取
受限制的访问 ##reader.subscriptionAccessGranted##
受限制的访问 订阅存取

详细

It is shown experimentally that using forced-convection boiling of dielectric coolants of the Novec 649 Refrigerant subcooled relative to the saturation temperature makes possible removing heat flow rates up to 100 W/cm2 from modern supercomputer chip interface. This fact creates prerequisites for the application of dielectric liquids in cooling systems of modern supercomputers with increased requirements for their operating reliability.

作者简介

Yu. Zeigarnik

Joint Institute for High Temperatures

Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow

N. Vasil’ev

Joint Institute for High Temperatures; Bauman Moscow State Technical University (National Research University)

Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow; Moscow

E. Druzhinin

ZAO RSK Technologies

Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow

I. Kalmykov

Joint Institute for High Temperatures

编辑信件的主要联系方式.
Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow

A. Kosoi

Joint Institute for High Temperatures

Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow

K. Khodakov

Joint Institute for High Temperatures

Email: ikalmykov@rambler.ru
俄罗斯联邦, Moscow

补充文件

附件文件
动作
1. JATS XML

版权所有 © Pleiades Publishing, Ltd., 2018