Enviar artigo por via de e-mail Prospects for Boiling of Subcooled Dielectric Liquids for Supercomputer Cooling
- Autores: Zeigarnik Y.A.1, Vasil’ev N.V.1,2, Druzhinin E.A.3, Kalmykov I.V.1, Kosoi A.S.1, Khodakov K.A.1
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Afiliações:
- Joint Institute for High Temperatures
- Bauman Moscow State Technical University (National Research University)
- ZAO RSK Technologies
- Edição: Volume 63, Nº 2 (2018)
- Páginas: 58-60
- Seção: Physics
- URL: https://journals.rcsi.science/1028-3358/article/view/192683
- DOI: https://doi.org/10.1134/S102833581802012X
- ID: 192683
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Resumo
It is shown experimentally that using forced-convection boiling of dielectric coolants of the Novec 649 Refrigerant subcooled relative to the saturation temperature makes possible removing heat flow rates up to 100 W/cm2 from modern supercomputer chip interface. This fact creates prerequisites for the application of dielectric liquids in cooling systems of modern supercomputers with increased requirements for their operating reliability.
Sobre autores
Yu. Zeigarnik
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
Rússia, Moscow
N. Vasil’ev
Joint Institute for High Temperatures; Bauman Moscow State Technical University (National Research University)
Email: ikalmykov@rambler.ru
Rússia, Moscow; Moscow
E. Druzhinin
ZAO RSK Technologies
Email: ikalmykov@rambler.ru
Rússia, Moscow
I. Kalmykov
Joint Institute for High Temperatures
Autor responsável pela correspondência
Email: ikalmykov@rambler.ru
Rússia, Moscow
A. Kosoi
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
Rússia, Moscow
K. Khodakov
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
Rússia, Moscow
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