Prospects for Boiling of Subcooled Dielectric Liquids for Supercomputer Cooling
- Authors: Zeigarnik Y.A.1, Vasil’ev N.V.1,2, Druzhinin E.A.3, Kalmykov I.V.1, Kosoi A.S.1, Khodakov K.A.1
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Affiliations:
- Joint Institute for High Temperatures
- Bauman Moscow State Technical University (National Research University)
- ZAO RSK Technologies
- Issue: Vol 63, No 2 (2018)
- Pages: 58-60
- Section: Physics
- URL: https://journals.rcsi.science/1028-3358/article/view/192683
- DOI: https://doi.org/10.1134/S102833581802012X
- ID: 192683
Cite item
Abstract
It is shown experimentally that using forced-convection boiling of dielectric coolants of the Novec 649 Refrigerant subcooled relative to the saturation temperature makes possible removing heat flow rates up to 100 W/cm2 from modern supercomputer chip interface. This fact creates prerequisites for the application of dielectric liquids in cooling systems of modern supercomputers with increased requirements for their operating reliability.
About the authors
Yu. A. Zeigarnik
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
Russian Federation, Moscow
N. V. Vasil’ev
Joint Institute for High Temperatures; Bauman Moscow State Technical University (National Research University)
Email: ikalmykov@rambler.ru
Russian Federation, Moscow; Moscow
E. A. Druzhinin
ZAO RSK Technologies
Email: ikalmykov@rambler.ru
Russian Federation, Moscow
I. V. Kalmykov
Joint Institute for High Temperatures
Author for correspondence.
Email: ikalmykov@rambler.ru
Russian Federation, Moscow
A. S. Kosoi
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
Russian Federation, Moscow
K. A. Khodakov
Joint Institute for High Temperatures
Email: ikalmykov@rambler.ru
Russian Federation, Moscow
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