Prospects for Boiling of Subcooled Dielectric Liquids for Supercomputer Cooling


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Abstract

It is shown experimentally that using forced-convection boiling of dielectric coolants of the Novec 649 Refrigerant subcooled relative to the saturation temperature makes possible removing heat flow rates up to 100 W/cm2 from modern supercomputer chip interface. This fact creates prerequisites for the application of dielectric liquids in cooling systems of modern supercomputers with increased requirements for their operating reliability.

About the authors

Yu. A. Zeigarnik

Joint Institute for High Temperatures

Email: ikalmykov@rambler.ru
Russian Federation, Moscow

N. V. Vasil’ev

Joint Institute for High Temperatures; Bauman Moscow State Technical University (National Research University)

Email: ikalmykov@rambler.ru
Russian Federation, Moscow; Moscow

E. A. Druzhinin

ZAO RSK Technologies

Email: ikalmykov@rambler.ru
Russian Federation, Moscow

I. V. Kalmykov

Joint Institute for High Temperatures

Author for correspondence.
Email: ikalmykov@rambler.ru
Russian Federation, Moscow

A. S. Kosoi

Joint Institute for High Temperatures

Email: ikalmykov@rambler.ru
Russian Federation, Moscow

K. A. Khodakov

Joint Institute for High Temperatures

Email: ikalmykov@rambler.ru
Russian Federation, Moscow

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