Real-Time Control of Nonflatness of Components of Infrared-Range Flip-Chip Photodetectors


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Abstract

A possibility of using the autocollimation and interference methods for real-time nondestructive check of the wafer nonflatness of photodetector arrays that are sensitive in the infrared range and are fabricated by the flip-chip technology is considered. These methods allow monitoring the wafer nonflatness and the maximum deflections. These methods are applied in the present study to measure the wafer nonflatness of fragments of silicon slices and arrays of photosensitive elements on GaAs substrates, as well as the wafer nonflatness of photodetectors at different stages of fracture and in the course of thermal cycling.

About the authors

A. R. Novoselov

Design and Technology Institute of Applied Microelectronics, Novosibirsk Department of the Rzhanov Institute of Semiconductor Physics, Siberian Branch

Author for correspondence.
Email: novoselov@oesd.ru
Russian Federation, pr. Akademika Lavrent’eva 2/1, Novosibirsk, 630090

P. A. Aldokhin

Design and Technology Institute of Applied Microelectronics, Novosibirsk Department of the Rzhanov Institute of Semiconductor Physics, Siberian Branch

Email: matochkin@iae.nsk.su
Russian Federation, pr. Akademika Lavrent’eva 2/1, Novosibirsk, 630090

A. E. Matochkin

Institute of Automation and Electrometry, Siberian Branch

Author for correspondence.
Email: matochkin@iae.nsk.su
Russian Federation, pr. Akademika Koptyuga 1, Novosibirsk, 630090

P. P. Dobrovolskii

Design and Technology Institute of Applied Microelectronics, Novosibirsk Department of the Rzhanov Institute of Semiconductor Physics, Siberian Branch

Email: matochkin@iae.nsk.su
Russian Federation, pr. Akademika Lavrent’eva 2/1, Novosibirsk, 630090

K. P. Shatunov

Design and Technology Institute of Applied Microelectronics, Novosibirsk Department of the Rzhanov Institute of Semiconductor Physics, Siberian Branch

Email: matochkin@iae.nsk.su
Russian Federation, pr. Akademika Lavrent’eva 2/1, Novosibirsk, 630090

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