Influence of Hot Pressing Temperature of Composite Copper-Titanium Billets on the Formation of Intermetallide Layer at the Material Interface

Billets for drawing of microwires based on Grade 4 titanium and protective sheath of M1 copper have been obtained at different temperatures by hot pressing method with drawing coefficient µ = 16. The influence of the billet heating temperature on the pressing pressure, configuration of the interface of bimetal materials and thickness of the intermetallide layer is shown. The influence of elastic compression pressure of composite copper-titanium billets in the range of 350–1400 MPa on the formation of intermetallide at the interface of materials at 850°C has been analyzed.