Two-sided laser shock processing

G. Zh. Sakhvadze; M. S. Pugachev; O. G. Kikvidze

doi:10.3103/S1068798X17010191

Two-sided laser shock processing

作者: Sakhvadze G.Z.¹, Pugachev M.S.¹, Kikvidze O.G.²
隶属关系:
1. Blagonravov Institute of Mechanical Engineering
2. Tsereteli State University
期: 卷 37, 编号 1 (2017)
页面: 40-45
栏目: Article
URL: https://journals.rcsi.science/1068-798X/article/view/227216
DOI: https://doi.org/10.3103/S1068798X17010191
ID: 227216

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详细

The principles of two-sided laser shock processing (LSP) are considered. The differences between two-sided and one-sided laser shock processing are noted. For the example of a thin VT-6 titanium-alloy plate, finite-element modeling is used to investigate the residual stress field when using two-sided LSP. The distribution of surface microhardness is analyzed.