Enviar artigo por via de e-mail Two-sided laser shock processing
- Autores: Sakhvadze G.Z.1, Pugachev M.S.1, Kikvidze O.G.2
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Afiliações:
- Blagonravov Institute of Mechanical Engineering
- Tsereteli State University
- Edição: Volume 37, Nº 1 (2017)
- Páginas: 40-45
- Seção: Article
- URL: https://journals.rcsi.science/1068-798X/article/view/227216
- DOI: https://doi.org/10.3103/S1068798X17010191
- ID: 227216
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Resumo
The principles of two-sided laser shock processing (LSP) are considered. The differences between two-sided and one-sided laser shock processing are noted. For the example of a thin VT-6 titanium-alloy plate, finite-element modeling is used to investigate the residual stress field when using two-sided LSP. The distribution of surface microhardness is analyzed.
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Sobre autores
G. Sakhvadze
Blagonravov Institute of Mechanical Engineering
Autor responsável pela correspondência
Email: sakhvadze@mail.ru
Rússia, Moscow
M. Pugachev
Blagonravov Institute of Mechanical Engineering
Email: sakhvadze@mail.ru
Rússia, Moscow
O. Kikvidze
Tsereteli State University
Email: sakhvadze@mail.ru
Geórgia, Kutaisi
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