Determining the Self-Thermal Impedances of Power Transistors and Diodes of an IGBT Module Based on Its 3D Model


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Abstract

An approach to determine self-thermal impedances for construction of a thermal model of a power IGBT module based on the electrothermal analogy method has been considered. Unlike the conventional method, the suggested approach takes into account a change in the thermal resistances depending on the location of a power semiconductor device in the IGBT module. The thermal parameters to construct the model of a power module based on the electrothermal analogy were determined by the finite element method using a 3D model of the IGBT module in the ANSYS environment. The suggested approach is intended to improve the quality of prediction of temperature of chips in the power module under conditions close to operating ones.

About the authors

M. V. Ilyin

Ogarev Mordovia State University

Author for correspondence.
Email: journal-elektrotechnika@mail.ru
Russian Federation, Saransk, 430005

E. A. Vilkov

Ogarev Mordovia State University

Email: journal-elektrotechnika@mail.ru
Russian Federation, Saransk, 430005

I. V. Gulyaev

Ogarev Mordovia State University

Email: journal-elektrotechnika@mail.ru
Russian Federation, Saransk, 430005

F. Briz del Blanco

Ogarev Mordovia State University; University of Oviedo

Email: journal-elektrotechnika@mail.ru
Russian Federation, Saransk, 430005; Oviedo, 33003

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