电邮这篇文章 Addressing the underlying causes of failure of soldered joints of electrical products
- 作者: Shtennikov V.N.1
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隶属关系:
- Yeltsin Ural Federal University
- 期: 卷 87, 编号 1 (2016)
- 页面: 51-52
- 栏目: Article
- URL: https://journals.rcsi.science/1068-3712/article/view/229899
- DOI: https://doi.org/10.3103/S1068371216010090
- ID: 229899
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详细
This paper analyzes the main reasons for the formation of solder joint defects of electrical products. Ways to correct them based on research work and experimental studies are shown. Results are used in serial production.
作者简介
V. Shtennikov
Yeltsin Ural Federal University
编辑信件的主要联系方式.
Email: journal-elektrotechnika@mail.ru
俄罗斯联邦, Yekaterinburg
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