Addressing the underlying causes of failure of soldered joints of electrical products


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Abstract

This paper analyzes the main reasons for the formation of solder joint defects of electrical products. Ways to correct them based on research work and experimental studies are shown. Results are used in serial production.

About the authors

V. N. Shtennikov

Yeltsin Ural Federal University

Author for correspondence.
Email: journal-elektrotechnika@mail.ru
Russian Federation, Yekaterinburg

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