Scratch Behavior of ZrO2 Thin Film Prepared by Atomic Layer Deposition Method on Silicon Wafer

Аннотация

To evaluate friction behaviour and adhesion strength of 130 nm-thick zirconia (ZrO₂) film produceded by atomic layer deposition (ALD) on Si substrate, scratch tests were performed at two different scales; micro- and macro-scales. Surface morphology, roughness, crack propagations and interations between the surface and sliding indenter were also investigated. Scratch test was also conducted with Si substrate as a reference. The test results showed that friction coefficient (COF) was influenced by the scale of scratch test regardless of the tested materials. In microscale test, the 130 nm-thick zirconia film failed at the critical load of 96 mN and direct relationship between the generation of micro-cracks and friction coefficient was observed. Based on the Hertzian contact theory and experimental results, the macroscratch width was much greater than that in microscratch test although the maximum contact pressure were comparable in both cases. Further discussion was made with regard to the influence of the contact pressure on COF, crack generation and film removal. Various types of failure mode were identified through analyzing the mechanical response of scratch tracks both at micro- and macroscale tests. This study suggested that 130 nm-thick ALD-ZrO₂ film showed better tribological and adhesion properties at microscale contact than macroscale contact.