Technical Methods and Facilities of Printed-Film Topology Reengineering of Radio-Electronic Products
- Authors: Kostin M.S.1, Vorunichev D.S.1, Vikulov V.M.1
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Affiliations:
- MIREA – Russian Technological University
- Issue: Vol 64, No 3 (2019)
- Pages: 193-197
- Section: TO THE 70th ANNIVERSARY OF MIREA
- URL: https://journals.rcsi.science/1064-2269/article/view/200422
- DOI: https://doi.org/10.1134/S1064226919020098
- ID: 200422
Cite item
Abstract
Abstrac
t—The methods and facilities of reengineering the topology of multilayered printed modules and case-type integrated microcircuits are considered. Concepts of reengineering modernization of the products of radio-electronics are formulated. Basic technological processes of schematic configuration reengineering of printed-film electronic products are presented, which are based on different physical principles of destructive (machining and chemical etching) and nondestructive study: optical scanning, radio-wave imaging, and X-ray analysis. The method of infrared imaging (electric-induction) analysis of printed circuit boards with multilayer topology was proposed for the first time.
About the authors
M. S. Kostin
MIREA – Russian Technological University
Author for correspondence.
Email: mihailkos@mail.ru
Russian Federation, Moscow, 119454
D. S. Vorunichev
MIREA – Russian Technological University
Email: mihailkos@mail.ru
Russian Federation, Moscow, 119454
V. M. Vikulov
MIREA – Russian Technological University
Email: mihailkos@mail.ru
Russian Federation, Moscow, 119454