Technical Methods and Facilities of Printed-Film Topology Reengineering of Radio-Electronic Products

Abstract

Abstrac

t—The methods and facilities of reengineering the topology of multilayered printed modules and case-type integrated microcircuits are considered. Concepts of reengineering modernization of the products of radio-electronics are formulated. Basic technological processes of schematic configuration reengineering of printed-film electronic products are presented, which are based on different physical principles of destructive (machining and chemical etching) and nondestructive study: optical scanning, radio-wave imaging, and X-ray analysis. The method of infrared imaging (electric-induction) analysis of printed circuit boards with multilayer topology was proposed for the first time.