Features of the Architecture Implementing the Dataflow Computational Model and Its Application in the Creation of Microelectronic High-Performance Computing Systems


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Resumo

At present, high-performance computations are in general use: in the government sector, defense sphere, large-scale concerns and enterprises, commercial entities, etc. From year-to-year, increasing sums are invested in supercomputers and software to rapidly answer any challenges in some field. In general, present-day high-performance computing systems are based on the von Neumann computation model. This, in turn, imposes certain restrictions, in particular, on paralleling computations and, as a consequence, on the creation of effective parallel applications. In this paper, one of the ways of solving this problem is proposed, namely, transition to the original dataflow computation model with a dynamically generated context and its implementation in a parallel dataflow computing system. Peculiarities of the parallel dataflow computing system architecture and the advantages offered by them are described. Such architectures will be in demand when creating new microelectronic high-performance computation systems.

Sobre autores

D. Zmeev

Institute for Design Problems in Microelectronics, Russian Academy of Sciences

Email: oku@ippm.ru
Rússia, Zelenograd, Moscow, 124365

A. Klimov

Institute for Design Problems in Microelectronics, Russian Academy of Sciences

Email: oku@ippm.ru
Rússia, Zelenograd, Moscow, 124365

N. Levchenko

Institute for Design Problems in Microelectronics, Russian Academy of Sciences

Email: oku@ippm.ru
Rússia, Zelenograd, Moscow, 124365

A. Okunev

Institute for Design Problems in Microelectronics, Russian Academy of Sciences

Autor responsável pela correspondência
Email: oku@ippm.ru
Rússia, Zelenograd, Moscow, 124365

A. Stempkovskii

Institute for Design Problems in Microelectronics, Russian Academy of Sciences

Email: oku@ippm.ru
Rússia, Zelenograd, Moscow, 124365


Declaração de direitos autorais © Pleiades Publishing, Ltd., 2019

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