Simulating the chlorine plasma etching profile of high-aspect-ratio trenches in Si
- Авторлар: Shumilov A.1, Amirov I.1, Luckichev V.2
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Мекемелер:
- Institute of Physics and Technology, Yaroslavl’ Branch
- Institute of Physics and Technology
- Шығарылым: Том 46, № 5 (2017)
- Беттер: 301-308
- Бөлім: Article
- URL: https://journals.rcsi.science/1063-7397/article/view/186491
- DOI: https://doi.org/10.1134/S1063739717050092
- ID: 186491
Дәйексөз келтіру
Аннотация
We simulate etching trenches in Si with a high (over 15) aspect ratio, i.e., the ratio between the trench depth and width in Cl2 plasma in wide ranges of the ratio between the flows of Cl atoms and Cl+ ions (3–300) and ion energies (50–250 eV). We demonstrate that the trenches with a high aspect (HA) ratio (~20) and almost vertical walls can be formed at the maximum energies of Ei = 250 eV and R = 300. At the lower values of these parameters, etching an HA-ratio trench is accompanied by its narrowing, curvature, or bending. We discuss the origin of the HA-trench bending effect at small R values and a high energy of the incident ions.
Авторлар туралы
A. Shumilov
Institute of Physics and Technology, Yaroslavl’ Branch
Хат алмасуға жауапты Автор.
Email: AndShumilov@gmail.com
Ресей, Yaroslavl’, 150007
I. Amirov
Institute of Physics and Technology, Yaroslavl’ Branch
Email: AndShumilov@gmail.com
Ресей, Yaroslavl’, 150007
V. Luckichev
Institute of Physics and Technology
Email: AndShumilov@gmail.com
Ресей, Moscow, 117218