Use of Silicon-Germanium Technology for the Development of Active Microwave Units of Active Electronically Scanned Arrays


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Abstract

The possibility of using new technologies to develop active microwave units of transmit/receive modules is considered. A comparative analysis of technological processes for core chip implementation is given. The possible achievable parameters of the universal core chip for X-band SiGe technology are estimated.

About the authors

V. P. Timoshenkov

National Research University of Electronic Technology

Author for correspondence.
Email: valeri04@hotmail.com
Russian Federation, Moscow

A. G. Efimov

Branch of DOOO Izhevskiy Radiozavod

Email: valeri04@hotmail.com
Russian Federation, Moscow


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