In-process monitoring of shape accuracy of flat surfaces of optical and microelectronic components in polishing

Yu. D. Filatov; V. I. Sidorko; S. V. Kovalev; O. Yu. Filativ; G. Monteil

doi:10.3103/S1063457617040086

In-process monitoring of shape accuracy of flat surfaces of optical and microelectronic components in polishing

作者: Filatov Y.D.¹, Sidorko V.I.¹, Kovalev S.V.¹, Filativ O.Y.¹, Monteil G.²
隶属关系:
1. Bakul Institute for Superhard Materials
2. École Nationale Supérieure de Mécanique et des Microtechniques
期: 卷 39, 编号 4 (2017)
页面: 282-287
栏目: Investigation of Machining Processes
URL: https://journals.rcsi.science/1063-4576/article/view/185935
DOI: https://doi.org/10.3103/S1063457617040086
ID: 185935

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详细

The in-process monitoring of surface shape of optical surfaces directly in the course of polishing is demonstrated to be accomplished through the confocal chromatic imaging technology. A linear relationship has been found between the deviation from square waveform and the variation of the workpiece surface shape.