Studying the Elastic Stresses at the Edges of a Section of the SOI Heterostructure of a Micro-Electromechanical Pressure Transducer with an Isolated Tensoframe

Resumo

The elastic stresses on the edges of a section of a micromechanical silicon tensoframe–glassy dielectric layer–silicon membrane structure are investigated, along with the topology of a local area on the surface of the transitional layer of a chip for a micro-electromechanical (MEMS) pressure transducer with an isolated 3D tensoframe.