Evolution of surface morphology during the growth of amorphous and polycrystalline silicon films


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The evolution of the surface morphology of LPCVD poly-Si films (deposition temperature 620°C), a-Si films (deposition temperature 550°C) and poly-Si films, obtained by the crystallization of a-Si is investigated in the thickness range 40–500 nm. It is found that upon an increase in the thickness from 40 to 500 nm, the surface roughness (parameters Sq, Sz, Sv) is increased for poly-Si, while in the case of a-Si and poly-Si obtained by crystallization a-Si, on the contrary, decreases. The correlation length (Sal) increases for all three types of silicon films. Poly-Si films, obtained by the crystallization of a-Si, as compared to LPCVD poly-Si films have a significantly lower surface roughness, respectively, Sq two times less at a thickness of 40 nm and sixteen times less at 500 nm. In contrast to thick films, thin a-Si films (at thicknesses of less than 40 nm) have a granular structure, which is especially pronounced at an average thickness of about 20 nm and there is a maximum on the dependence of the roughness Sq on the thickness.

作者简介

A. Novak

National Research University of Electronic Technology (MIET); “Angstrem”Public Corporation

Email: novak-andrei@mail.ru
俄罗斯联邦, Zelenograd, 124498; Zelenograd, 124460

V. Novak

Lukin Research Institute of Physical Problems

编辑信件的主要联系方式.
Email: novak-andrei@mail.ru
俄罗斯联邦, Zelenograd, 124460

D. Smirnov

National Research University of Electronic Technology (MIET); Lebedev Physical Institute

Email: novak-andrei@mail.ru
俄罗斯联邦, Zelenograd, 124498; Moscow, 119991

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