Simulation of Redeposited Silicon Sputtering under Focused Ion Beam Irradiation


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The processes of redeposited and crystalline silicon sputtering under focused Ga ion-beam irradiation are simulated using the Monte Carlo method and different models of the surface binding energy of Si and Ga atoms. The sputtering yields and the profiles of the distribution of Ga atoms in the sample, calculated for different ion energies, are compared with the experimental data. It is established that the introduced model of the surface binding energy of Si and Ga atoms, taking into account the formation of Ga precipitates in the near-surface region of the sample, makes it possible to reach the best agreement with the experimental data.

作者简介

N. Borgardt

National Research University of Electronic Technology “MIET”

Email: lemi@miee.ru
俄罗斯联邦, Zelenograd, Moscow, 124498

R. Volkov

National Research University of Electronic Technology “MIET”

Email: lemi@miee.ru
俄罗斯联邦, Zelenograd, Moscow, 124498

A. Rumyantsev

National Research University of Electronic Technology “MIET”

编辑信件的主要联系方式.
Email: lemi@miee.ru
俄罗斯联邦, Zelenograd, Moscow, 124498

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