Calculation of Thermal Processes in a Bonded Diamond Tool During Grinding of Glass and Other Materials
- Autores: Kondratenko V.S.1, Kadomkin V.V.1
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Afiliações:
- MIREA – Russian Technological University
- Edição: Volume 75, Nº 11-12 (2019)
- Páginas: 428-434
- Seção: Materials Processing
- URL: https://journals.rcsi.science/0361-7610/article/view/245095
- DOI: https://doi.org/10.1007/s10717-019-00105-6
- ID: 245095
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Resumo
The results of calculations of thermal processes occurring in a bonded diamond tool during grinding of different materials on the surface in the contact zone with the machined material and in the interior of the diamond tool are presented. Amathematical model of the heating of the binder of the diamond tool as a result of friction in the grinding zone and cooling by a cutting liquid (CL) is described.
Sobre autores
V. Kondratenko
MIREA – Russian Technological University
Autor responsável pela correspondência
Email: vsk1950@mail.ru
Rússia, Moscow
V. Kadomkin
MIREA – Russian Technological University
Email: vsk1950@mail.ru
Rússia, Moscow
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