Calculation of Thermal Processes in a Bonded Diamond Tool During Grinding of Glass and Other Materials
- 作者: Kondratenko V.S.1, Kadomkin V.V.1
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隶属关系:
- MIREA – Russian Technological University
- 期: 卷 75, 编号 11-12 (2019)
- 页面: 428-434
- 栏目: Materials Processing
- URL: https://journals.rcsi.science/0361-7610/article/view/245095
- DOI: https://doi.org/10.1007/s10717-019-00105-6
- ID: 245095
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详细
The results of calculations of thermal processes occurring in a bonded diamond tool during grinding of different materials on the surface in the contact zone with the machined material and in the interior of the diamond tool are presented. Amathematical model of the heating of the binder of the diamond tool as a result of friction in the grinding zone and cooling by a cutting liquid (CL) is described.
作者简介
V. Kondratenko
MIREA – Russian Technological University
编辑信件的主要联系方式.
Email: vsk1950@mail.ru
俄罗斯联邦, Moscow
V. Kadomkin
MIREA – Russian Technological University
Email: vsk1950@mail.ru
俄罗斯联邦, Moscow
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