Thermal stability of the microstructure of silver films
- Авторлар: Sursaeva V.1, Straumal A.1
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Мекемелер:
- Institute of Solid State Physics
- Шығарылым: Том 2017, № 4 (2017)
- Беттер: 263-266
- Бөлім: Advanced Materials and Technologies
- URL: https://journals.rcsi.science/0036-0295/article/view/171397
- DOI: https://doi.org/10.1134/S003602951704022X
- ID: 171397
Дәйексөз келтіру
Аннотация
The thermal stability of freely suspended silver films 100 nm thick is studied during isothermal annealing at temperatures of 350–600°C for different times. At temperatures of 350–450°C, only grain growth is observed. Above 450°C, along with grain growth, the formation and growth of hillocks and holes take place; in this case, grain boundaries are essential in the processes. A continuous film transforms into a cellular one. At 500°C, the growth processes of both grains and holes have the same incubation period, during which no grain growth, hole formation, and hole growth take place.
Авторлар туралы
V. Sursaeva
Institute of Solid State Physics
Хат алмасуға жауапты Автор.
Email: sursaeva@issp.ac.ru
Ресей, Chernogolovka, 142432
A. Straumal
Institute of Solid State Physics
Email: sursaeva@issp.ac.ru
Ресей, Chernogolovka, 142432
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